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Showing results 11 to 16 of 16 < previous

	Title	Author(s)	Issue Date	Views
	Rotational perturbations in Neveu-Schwarz–Neveu-Schwarz string cosmology Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, TC Mak, MK	2001	78
	Study of grain size effect of Cu metallization on interfacial microstructures of solder joints Journal:Microelectronics Reliability	ZHENG, Z Chiang, PC Huang, YT Wang, WT Li, PC Tsai, YH Chen, CM Feng, SP	2019	37
	Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit Journal:JOM	Tsai, ST Chiang, PC Liu, C Feng, SP Chen, CM	2019	38
	Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells Journal:Journal of The Electrochemical Society	Huang, Y Zhan, YY Cherng, SJ Chen, CM Feng, SPT Wei, TC	2013	78
	Synergetic effect of Bi 2 Te 3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi 2 Te 3 joints Journal:Journal of Alloys and Compounds	Lin, CF HAU, NY HUANG, Y-T CHANG, Y-H Feng, SPT Chen, CM	2017	49
	Viscous dissipative effects in isotropic brane cosmology Journal:Physical Review D (Particles and Fields)	Chen, CM Harko, TC Mak, MK	2001	100

Showing results 11 to 16 of 16 < previous