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Showing results 1 to 12 of 12

	Title	Author(s)	Issue Date	Views
	Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration Proceeding/Conference:2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09	Xie, J Chung, D Swaminathan, M Mcallister, M Deutsch, A Jiang, L Rubin, BJ	2009	112
	Electrical-thermal co-analysis for power delivery networks in 3D system integration Proceeding/Conference:2009 IEEE International Conference on 3D System Integration, 3DIC 2009	Xie, J Chung, D Swaminathan, M Mcallister, M Deutsch, A Jiang, L Rubin, BJ	2009	188
	Electromagnetic simulation for inhomogeneous interconnect and packaging structures Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Jiang, L Rubin, BJ Liu, Y Morsey, JD Deustch, A	2007	105
	Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD	Xu, C Jiang, L Kolluri, SK Rubin, BJ Deutsch, A Smith, H Banerjee, K	2009	171
	Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer Proceeding/Conference:Proceedings - Electronic Components and Technology Conference	Morsey, JD Jiang, L Rubin, BJ Deutsch, A Surovic, CW Becker, D Haridass, A	2008	109
	Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Jiang, LJ Rubin, BJ Morsey, JD Hu, HT Elfadel, A	2006	117
	On the dual basis for solving electromagnetic surface integral equations Journal:IEEE Transactions on Antennas and Propagation	Tong, MS Chew, WC Rubin, BJ Morsey, JD Jiang, L	2009	166
	Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Jiang, L Kolluri, S Rubin, BJ Smith, H Colgan, EG Scheuermann, MR Wakit, JA Deutsch, A Gill, J	2008	114
	A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging	Jiang, L Xu, C Rubin, BJ Weger, AJ Deutsch, A Smith, H Caron, A Banerjee, K	2010	153
	The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM Proceeding/Conference:IEEE Transactions on Advanced Packaging	Morsey, J Deutsch, A Libous, JP Surovic, C Rubin, BJ Jiang, L Eisenberg, L	2007	105
	The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM Proceeding/Conference:IEEE Topical Meeting on Electrical Performance of Electronic Packaging	Morsey, J Deutsch, A Libous, JP Surovic, C Rubin, BJ Jiang, L Eisenberg, L	2005	109
	The use of fast integral equations solvers for practical package and interconnect analysis Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP	Morsey, JD Rubin, BJ Jiang, L Shan, L Eisenberg, LB Becker, D Arseneault, M	2006	112

Showing results 1 to 12 of 12