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Article: A toolpath design platform for multi-material layered manufacturing

TitleA toolpath design platform for multi-material layered manufacturing
Authors
KeywordsApplication requirements
Constraint modelling
Design platform
Digital fabrication
Effective tool
Issue Date2011
PublisherCAD Solutions. The Journal's web site is located at http://www.cadanda.com
Citation
Computer-Aided Design and Applications, 2011, v. 8 n. 5, p. 759-771 How to Cite?
AbstractToolpath planning is vital to multi-material layered manufacturing (MMLM), particularly for improvements in fabrication efficiency and quality of prototypes. This paper proposes a toolpath design platform (TDP) for planning and validation of toolpaths in MMLM. The TDP consists of three constraint modelling modules to represent common operational and mechanical constraints of an MMLM process, and subsequently generate feasible and efficient toolpaths for digital fabrication of multimaterial prototypes in a built-in virtual prototyping (VP) module. The material deposition speeds and priorities can also be adjusted to suit various material properties and optimize the toolpaths. Simulations show that the TDP is an effective tool to model and simulate MMLM processes, and accordingly generate practicable toolpath strategies for different application requirements. © 2011 CAD Solutions, LLC.
Persistent Identifierhttp://hdl.handle.net/10722/137303
ISSN
2020 SCImago Journal Rankings: 0.327
References

 

DC FieldValueLanguage
dc.contributor.authorChoi, SHen_HK
dc.contributor.authorCai, Yen_HK
dc.date.accessioned2011-08-26T14:22:55Z-
dc.date.available2011-08-26T14:22:55Z-
dc.date.issued2011en_HK
dc.identifier.citationComputer-Aided Design and Applications, 2011, v. 8 n. 5, p. 759-771en_HK
dc.identifier.issn1686-4360en_HK
dc.identifier.urihttp://hdl.handle.net/10722/137303-
dc.description.abstractToolpath planning is vital to multi-material layered manufacturing (MMLM), particularly for improvements in fabrication efficiency and quality of prototypes. This paper proposes a toolpath design platform (TDP) for planning and validation of toolpaths in MMLM. The TDP consists of three constraint modelling modules to represent common operational and mechanical constraints of an MMLM process, and subsequently generate feasible and efficient toolpaths for digital fabrication of multimaterial prototypes in a built-in virtual prototyping (VP) module. The material deposition speeds and priorities can also be adjusted to suit various material properties and optimize the toolpaths. Simulations show that the TDP is an effective tool to model and simulate MMLM processes, and accordingly generate practicable toolpath strategies for different application requirements. © 2011 CAD Solutions, LLC.en_HK
dc.languageengen_US
dc.publisherCAD Solutions. The Journal's web site is located at http://www.cadanda.comen_HK
dc.relation.ispartofComputer-Aided Design and Applicationsen_HK
dc.subjectApplication requirementsen_HK
dc.subjectConstraint modellingen_HK
dc.subjectDesign platformen_HK
dc.subjectDigital fabrication-
dc.subjectEffective tool-
dc.titleA toolpath design platform for multi-material layered manufacturingen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1686-4360&volume=8 &issue=5&spage=759&epage=771&date=2011&atitle=A+Toolpath+Design+Platform+for+Multi-material+Layered+Manufacturingen_US
dc.identifier.emailChoi, SH: shchoi@hku.hken_HK
dc.identifier.emailCai, Y: chairekk@hku.hk-
dc.identifier.authorityChoi, SH=rp00109en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.3722/cadaps.2011.759-771en_HK
dc.identifier.scopuseid_2-s2.0-79961004814en_HK
dc.identifier.hkuros190919en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-79961004814&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume8en_HK
dc.identifier.issue5en_HK
dc.identifier.spage759en_HK
dc.identifier.epage771en_HK
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridCai, Y=45161107300en_HK
dc.identifier.scopusauthoridChoi, SH=7408119615en_HK
dc.identifier.issnl1686-4360-

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