File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

TitleElectrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3
Authors
TSENG, YCLEE, HHAU, NYFeng, SPTCHEN, CM
KeywordsElectroplating
intermetallic compound
Ni
thermoelectric
Issue Date2018
Citation
Journal of Electronic Materials, 2018, v. 47, p. 27-34 How to Cite?
DOI: http://dx.doi.org/10.1007/s11664-017-5777-1
Persistent Identifierhttp://hdl.handle.net/10722/259347
ISSN
0361-5235
2021 Impact Factor: 2.047
2020 SCImago Journal Rankings: 0.422
ISI Accession Number ID
WOS:000418580800004

 

DC FieldValueLanguage
dc.contributor.authorTSENG, YC-
dc.contributor.authorLEE, H-
dc.contributor.authorHAU, NY-
dc.contributor.authorFeng, SPT-
dc.contributor.authorCHEN, CM-
dc.date.accessioned2018-09-03T04:05:45Z-
dc.date.available2018-09-03T04:05:45Z-
dc.date.issued2018-
dc.identifier.citationJournal of Electronic Materials, 2018, v. 47, p. 27-34-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10722/259347-
dc.languageeng-
dc.relation.ispartofJournal of Electronic Materials-
dc.subjectElectroplating-
dc.subjectintermetallic compound-
dc.subjectNi-
dc.subjectthermoelectric-
dc.titleElectrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3-
dc.typeArticle-
dc.identifier.emailFeng, SPT: hpfeng@hku.hk-
dc.identifier.authorityFeng, SPT=rp01533-
dc.identifier.doi10.1007/s11664-017-5777-1-
dc.identifier.scopuseid_2-s2.0-85028994352-
dc.identifier.hkuros288166-
dc.identifier.volume47-
dc.identifier.spage27-
dc.identifier.epage34-
dc.identifier.eissn1543-186X-
dc.identifier.isiWOS:000418580800004-
dc.identifier.issnl0361-5235-

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats