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Article: Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit

TitleSuppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit
Authors
KeywordsElectrodes
Grain growth
Substrates
Thermal aging
Cu electrodepositions
Issue Date2019
PublisherSpringer New York LLC. The Journal's web site is located at http://www.springer.com/materials/journal/11837
Citation
JOM, 2019, v. 71 n. 9, p. 3012-3022 How to Cite?
AbstractThe use of organic additives is crucial for Cu electrodeposition. However, specific impure species originating from the additives are incorporated in the Cu electroplated layer, causing serious reliability problems such as void formation at the solder/Cu joints. In this study, three Cu substrates were electroplated using various additive formulas. The use of organic additives results in an incorporation of a higher level of impurity in the Cu-electroplated layers and also affects the atomic deposition behavior of Cu which alters the grain microstructures. By using a specific additive formula, the grain growth of Cu evolves into a slender structure with a high density of twins. Thermal aging experiments of the Sn/Cu joints show that the void formation is successfully suppressed at the joint using a slender-grained Cu substrate, and that the suppression effect is attributed to the high microstructural stability of the twinning structure.
Persistent Identifierhttp://hdl.handle.net/10722/279456
ISSN
2017 Impact Factor: 2.145
2015 SCImago Journal Rankings: 0.998

 

DC FieldValueLanguage
dc.contributor.authorTsai, ST-
dc.contributor.authorChiang, PC-
dc.contributor.authorLiu, C-
dc.contributor.authorFeng, SP-
dc.contributor.authorChen, CM-
dc.date.accessioned2019-11-01T07:17:42Z-
dc.date.available2019-11-01T07:17:42Z-
dc.date.issued2019-
dc.identifier.citationJOM, 2019, v. 71 n. 9, p. 3012-3022-
dc.identifier.issn1047-4838-
dc.identifier.urihttp://hdl.handle.net/10722/279456-
dc.description.abstractThe use of organic additives is crucial for Cu electrodeposition. However, specific impure species originating from the additives are incorporated in the Cu electroplated layer, causing serious reliability problems such as void formation at the solder/Cu joints. In this study, three Cu substrates were electroplated using various additive formulas. The use of organic additives results in an incorporation of a higher level of impurity in the Cu-electroplated layers and also affects the atomic deposition behavior of Cu which alters the grain microstructures. By using a specific additive formula, the grain growth of Cu evolves into a slender structure with a high density of twins. Thermal aging experiments of the Sn/Cu joints show that the void formation is successfully suppressed at the joint using a slender-grained Cu substrate, and that the suppression effect is attributed to the high microstructural stability of the twinning structure.-
dc.languageeng-
dc.publisherSpringer New York LLC. The Journal's web site is located at http://www.springer.com/materials/journal/11837-
dc.relation.ispartofJOM-
dc.rightsThis is a post-peer-review, pre-copyedit version of an article published in [insert journal title]. The final authenticated version is available online at: http://dx.doi.org/[insert DOI]-
dc.subjectElectrodes-
dc.subjectGrain growth-
dc.subjectSubstrates-
dc.subjectThermal aging-
dc.subjectCu electrodepositions-
dc.titleSuppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit-
dc.typeArticle-
dc.identifier.emailLiu, C: willmole@hku.hk-
dc.identifier.emailFeng, SP: hpfeng@hku.hk-
dc.identifier.authorityFeng, SP=rp01533-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s11837-019-03576-8-
dc.identifier.scopuseid_2-s2.0-85067039838-
dc.identifier.hkuros308570-
dc.identifier.volume71-
dc.identifier.issue9-
dc.identifier.spage3012-
dc.identifier.epage3022-
dc.publisher.placeUnited States-

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