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Article: Microfluidic Encapsulation of Phase-Change Materials for High Thermal Performance

TitleMicrofluidic Encapsulation of Phase-Change Materials for High Thermal Performance
Authors
Issue Date2020
PublisherAmerican Chemical Society. The Journal's web site is located at http://pubs.acs.org/langmuir
Citation
Langmuir, 2020, v. 36 n. 28, p. 8165-8173 How to Cite?
AbstractMicroencapsulation of phase-change materials (PCMs) can prevent leakage of PCMs and enhance heat transfer with an increased surface area to volume ratio and thus benefit their pragmatic applications. However, the available methods have difficulties in microencapsulating PCMs with a tunable size, structure, and composition at will, thereby failing to accurately and flexibly tailor the thermal properties of microencapsulated PCMs (MEPCMs). Here, the microfluidic encapsulation of PCMs was presented for precisely fabricating MEPCMs with tunable thermal properties. The versatile fabrication of both organic and inorganic MEPCMs was demonstrated with high monodispersity, energy storage capacity, encapsulation efficiency, thermal stability, reliability, and heat charging and discharging rates. Notably, the inorganic MEPCMs exhibit an energy storage capacity of 269.3 J/g and a charging rate of 294.7 J/(g min), surpassing previously reported values. Owing to their high thermal performance, MEPCMs have been used for anticounterfeit applications. Droplet-based microfluidic fabrication opens up a new avenue for versatile fabrication of MEPCMs with well-tailored thermal properties, thus benefitting their applications.
Persistent Identifierhttp://hdl.handle.net/10722/293382
ISSN
2020 Impact Factor: 3.882
2020 SCImago Journal Rankings: 1.042
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorHAN, X-
dc.contributor.authorKong, T-
dc.contributor.authorZHU, P-
dc.contributor.authorWang, L-
dc.date.accessioned2020-11-23T08:15:56Z-
dc.date.available2020-11-23T08:15:56Z-
dc.date.issued2020-
dc.identifier.citationLangmuir, 2020, v. 36 n. 28, p. 8165-8173-
dc.identifier.issn0743-7463-
dc.identifier.urihttp://hdl.handle.net/10722/293382-
dc.description.abstractMicroencapsulation of phase-change materials (PCMs) can prevent leakage of PCMs and enhance heat transfer with an increased surface area to volume ratio and thus benefit their pragmatic applications. However, the available methods have difficulties in microencapsulating PCMs with a tunable size, structure, and composition at will, thereby failing to accurately and flexibly tailor the thermal properties of microencapsulated PCMs (MEPCMs). Here, the microfluidic encapsulation of PCMs was presented for precisely fabricating MEPCMs with tunable thermal properties. The versatile fabrication of both organic and inorganic MEPCMs was demonstrated with high monodispersity, energy storage capacity, encapsulation efficiency, thermal stability, reliability, and heat charging and discharging rates. Notably, the inorganic MEPCMs exhibit an energy storage capacity of 269.3 J/g and a charging rate of 294.7 J/(g min), surpassing previously reported values. Owing to their high thermal performance, MEPCMs have been used for anticounterfeit applications. Droplet-based microfluidic fabrication opens up a new avenue for versatile fabrication of MEPCMs with well-tailored thermal properties, thus benefitting their applications.-
dc.languageeng-
dc.publisherAmerican Chemical Society. The Journal's web site is located at http://pubs.acs.org/langmuir-
dc.relation.ispartofLangmuir-
dc.rightsThis document is the Accepted Manuscript version of a Published Work that appeared in final form in [JournalTitle], copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see [insert ACS Articles on Request author-directed link to Published Work, see http://pubs.acs.org/page/policy/articlesonrequest/index.html].-
dc.titleMicrofluidic Encapsulation of Phase-Change Materials for High Thermal Performance-
dc.typeArticle-
dc.identifier.emailWang, L: lqwang@hku.hk-
dc.identifier.authorityWang, L=rp00184-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1021/acs.langmuir.0c01171-
dc.identifier.pmid32575990-
dc.identifier.scopuseid_2-s2.0-85088494094-
dc.identifier.hkuros319526-
dc.identifier.volume36-
dc.identifier.issue28-
dc.identifier.spage8165-
dc.identifier.epage8173-
dc.identifier.isiWOS:000555006400013-
dc.publisher.placeUnited States-
dc.identifier.issnl0743-7463-

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