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Article: Osmotic blistering in enamel bonded with one-step self-etch adhesives

TitleOsmotic blistering in enamel bonded with one-step self-etch adhesives
Authors
KeywordsEnamel
Osmosis
Self-etch
Water blisters
Water trees
Issue Date2004
PublisherSage Publications, Inc.. The Journal's web site is located at http://www.sagepub.com/journalsProdDesc.nav?prodId=Journal201925
Citation
Journal Of Dental Research, 2004, v. 83 n. 4, p. 290-295 How to Cite?
AbstractOne-step self-etch adhesives behave as permeable membranes after polymerization, permitting water to move through the cured adhesives. We hypothesize that osmotic blistering occurs in bonded enamel when these adhesives are used without composite coupling. Tooth surfaces from extracted human premolars were bonded with 5 one-step self-etch adhesives. They were immersed in distilled water or 4.8 M CaCl2, and examined by stereomicroscopy, field-emission/environmental SEM, and TEM. Water blisters were observed in bonded enamel but not in bonded dentin when specimens were immersed in water. They collapsed when water was subsequently replaced with CaCl2. Blisters were absent from enamel in specimens that were immersed in CaCl 2 only. Water trees were identified from adhesive-enamel interfaces. Osmotic blistering in enamel is probably caused by the low water permeability of enamel. This creates an osmotic gradient between the bonded enamel and the external environment, causing water sorption into the interface.
Persistent Identifierhttp://hdl.handle.net/10722/53264
ISSN
2021 Impact Factor: 8.924
2020 SCImago Journal Rankings: 1.979
ISI Accession Number ID
References

 

DC FieldValueLanguage
dc.contributor.authorTay, FRen_HK
dc.contributor.authorLai, CNSen_HK
dc.contributor.authorChersoni, Sen_HK
dc.contributor.authorPashley, DHen_HK
dc.contributor.authorMak, YFen_HK
dc.contributor.authorSuppa, Pen_HK
dc.contributor.authorPrati, Cen_HK
dc.contributor.authorKing, NMen_HK
dc.date.accessioned2009-04-03T07:05:28Z-
dc.date.available2009-04-03T07:05:28Z-
dc.date.issued2004en_HK
dc.identifier.citationJournal Of Dental Research, 2004, v. 83 n. 4, p. 290-295en_HK
dc.identifier.issn0022-0345en_HK
dc.identifier.urihttp://hdl.handle.net/10722/53264-
dc.description.abstractOne-step self-etch adhesives behave as permeable membranes after polymerization, permitting water to move through the cured adhesives. We hypothesize that osmotic blistering occurs in bonded enamel when these adhesives are used without composite coupling. Tooth surfaces from extracted human premolars were bonded with 5 one-step self-etch adhesives. They were immersed in distilled water or 4.8 M CaCl2, and examined by stereomicroscopy, field-emission/environmental SEM, and TEM. Water blisters were observed in bonded enamel but not in bonded dentin when specimens were immersed in water. They collapsed when water was subsequently replaced with CaCl2. Blisters were absent from enamel in specimens that were immersed in CaCl 2 only. Water trees were identified from adhesive-enamel interfaces. Osmotic blistering in enamel is probably caused by the low water permeability of enamel. This creates an osmotic gradient between the bonded enamel and the external environment, causing water sorption into the interface.en_HK
dc.languageengen_HK
dc.publisherSage Publications, Inc.. The Journal's web site is located at http://www.sagepub.com/journalsProdDesc.nav?prodId=Journal201925en_HK
dc.relation.ispartofJournal of Dental Researchen_HK
dc.subjectEnamelen_HK
dc.subjectOsmosisen_HK
dc.subjectSelf-etchen_HK
dc.subjectWater blistersen_HK
dc.subjectWater treesen_HK
dc.titleOsmotic blistering in enamel bonded with one-step self-etch adhesivesen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0022-0345&volume=83&issue=4&spage=290&epage=295&date=2004&atitle=Osmotic+blistering+in+enamel+bonded+with+one-step+self-etch+adhesivesen_HK
dc.identifier.emailKing, NM: hhdbknm@hkucc.hku.hken_HK
dc.identifier.authorityKing, NM=rp00006en_HK
dc.description.naturepublished_or_final_versionen_HK
dc.identifier.doi10.1177/154405910408300404-
dc.identifier.pmid15044501en_HK
dc.identifier.scopuseid_2-s2.0-2342613606en_HK
dc.identifier.hkuros85597-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-2342613606&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume83en_HK
dc.identifier.issue4en_HK
dc.identifier.spage290en_HK
dc.identifier.epage295en_HK
dc.identifier.isiWOS:000226561400004-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridTay, FR=7102091962en_HK
dc.identifier.scopusauthoridLai, CNS=8511648700en_HK
dc.identifier.scopusauthoridChersoni, S=6701366857en_HK
dc.identifier.scopusauthoridPashley, DH=35448600800en_HK
dc.identifier.scopusauthoridMak, YF=7006764503en_HK
dc.identifier.scopusauthoridSuppa, P=9745732500en_HK
dc.identifier.scopusauthoridPrati, C=7006322243en_HK
dc.identifier.scopusauthoridKing, NM=7201762850en_HK
dc.identifier.issnl0022-0345-

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