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Conference Paper: Nanofluids heat conduction: numerical simulation

TitleNanofluids heat conduction: numerical simulation
Authors
Fan, JWang, L
Issue Date2009
PublisherTrans Tech Publications. The Journal's web site is located at http://www.ttp.net/1012-0386.html
Citation
The 5th International Conference on Diffusion in Solids and Liquids (DSL 2009), Rome, Italy, 24-26 June 2009. In Defect and Diffusion Forum, 2009, Diffusion in Solids and Liquids V, no. 2009-228.1 How to Cite?
Descriptionno. 2009-228.1
Persistent Identifierhttp://hdl.handle.net/10722/62242
ISBN
978-3-908451-80-8
ISSN
1012-0386
2020 SCImago Journal Rankings: 0.254

 

DC FieldValueLanguage
dc.contributor.authorFan, Jen_HK
dc.contributor.authorWang, Len_HK
dc.date.accessioned2010-07-13T03:57:01Z-
dc.date.available2010-07-13T03:57:01Z-
dc.date.issued2009en_HK
dc.identifier.citationThe 5th International Conference on Diffusion in Solids and Liquids (DSL 2009), Rome, Italy, 24-26 June 2009. In Defect and Diffusion Forum, 2009, Diffusion in Solids and Liquids V, no. 2009-228.1en_HK
dc.identifier.isbn978-3-908451-80-8-
dc.identifier.issn1012-0386-
dc.identifier.urihttp://hdl.handle.net/10722/62242-
dc.descriptionno. 2009-228.1en_HK
dc.languageengen_HK
dc.publisherTrans Tech Publications. The Journal's web site is located at http://www.ttp.net/1012-0386.htmlen_HK
dc.relation.ispartofDefect and Diffusion Forum-
dc.titleNanofluids heat conduction: numerical simulationen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailWang, L: lqwang@hku.hken_HK
dc.identifier.authorityWang, L=rp00184en_HK
dc.identifier.hkuros164975en_HK
dc.publisher.placeSwitzerland-
dc.identifier.issnl1012-0386-

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