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Article: Energy-rate consideration in wafer bonding

TitleEnergy-rate consideration in wafer bonding
Authors
Fan, HG Xu, JSze, KY
KeywordsContact mechanics
Energy rate
Finite element analysis
Wafer bonding
Issue Date2006
PublisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finel
Citation
Finite Elements In Analysis And Design, 2006, v. 42 n. 8-9, p. 709-714 How to Cite?
DOI: http://dx.doi.org/10.1016/j.finel.2005.10.003
AbstractIn the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. © 2005 Elsevier B.V. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76154
ISSN
0168-874X
2021 Impact Factor: 2.618
2020 SCImago Journal Rankings: 0.960
ISI Accession Number ID
WOS:000237216700007
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorFan, Hen_HK
dc.contributor.authorG Xu, Jen_HK
dc.contributor.authorSze, KYen_HK
dc.date.accessioned2010-09-06T07:18:09Z-
dc.date.available2010-09-06T07:18:09Z-
dc.date.issued2006en_HK
dc.identifier.citationFinite Elements In Analysis And Design, 2006, v. 42 n. 8-9, p. 709-714en_HK
dc.identifier.issn0168-874Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/76154-
dc.description.abstractIn the present study, we consider the bonding process of a pair of wafers with rough surfaces via an energy-rate concept in which "rate" refers to "area rate". A finite element numerical simulation for a rough surface with periodical distributed asperities bonded onto a rigid half-space is carried out for demonstrating the energy-rate concept. The simulation reveals various phenomena in the wafer bonding, such as self-activated bonding, asperity shape effect and plastic deformation effect in the bonding process. © 2005 Elsevier B.V. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherElsevier BV. The Journal's web site is located at http://www.elsevier.com/locate/finelen_HK
dc.relation.ispartofFinite Elements in Analysis and Designen_HK
dc.rightsFinite Elements in Analysis and Design. Copyright © Elsevier BV.en_HK
dc.subjectContact mechanicsen_HK
dc.subjectEnergy rateen_HK
dc.subjectFinite element analysisen_HK
dc.subjectWafer bondingen_HK
dc.titleEnergy-rate consideration in wafer bondingen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0168-874X&volume=42&spage=709&epage=714&date=2006&atitle=Energy-rate+consideration+in+wafer+bondingen_HK
dc.identifier.emailSze, KY:szeky@graduate.hku.hken_HK
dc.identifier.authoritySze, KY=rp00171en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.finel.2005.10.003en_HK
dc.identifier.scopuseid_2-s2.0-33645391542en_HK
dc.identifier.hkuros117415en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-33645391542&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume42en_HK
dc.identifier.issue8-9en_HK
dc.identifier.spage709en_HK
dc.identifier.epage714en_HK
dc.identifier.isiWOS:000237216700007-
dc.publisher.placeNetherlandsen_HK
dc.identifier.scopusauthoridFan, H=7402553644en_HK
dc.identifier.scopusauthoridG Xu, J=12797880900en_HK
dc.identifier.scopusauthoridSze, KY=7006735060en_HK
dc.identifier.issnl0168-874X-

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