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Article: Mode III interfacial edge crack in a magnetoelectroelastic bimaterial

TitleMode III interfacial edge crack in a magnetoelectroelastic bimaterial
Authors
Soh, AKLiu, JX
KeywordsBimaterial
Intensity factors
Interfacial crack
Magnetoelectroelasticity
Issue Date2004
PublisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net
Citation
Key Engineering Materials, 2004, v. 261-263 I, p. 393-398 How to Cite?
AbstractThis paper deals with a Mode III interfacial edge crack in a magnetoelectroelastic bimaterial subjected to line singularities such as an out-of-plane line force, a line electric charge, a line magnetic charge and a straight screw dislocation. The surfaces (including crack surfaces) of the bimateral are assumed to be electrically open and magnetically closed. The closed-form analytical solution to the problem is obtained by employing the complex variable approach in conjunction with the conformal mapping technique. The intensity factors of stress, electric displacement and magnetic induction are given explicitly. The obtained results can be used as the Green's function to solve more complicated problems.
Persistent Identifierhttp://hdl.handle.net/10722/76185
ISSN
1013-9826
2020 SCImago Journal Rankings: 0.175
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorSoh, AKen_HK
dc.contributor.authorLiu, JXen_HK
dc.date.accessioned2010-09-06T07:18:27Z-
dc.date.available2010-09-06T07:18:27Z-
dc.date.issued2004en_HK
dc.identifier.citationKey Engineering Materials, 2004, v. 261-263 I, p. 393-398en_HK
dc.identifier.issn1013-9826en_HK
dc.identifier.urihttp://hdl.handle.net/10722/76185-
dc.description.abstractThis paper deals with a Mode III interfacial edge crack in a magnetoelectroelastic bimaterial subjected to line singularities such as an out-of-plane line force, a line electric charge, a line magnetic charge and a straight screw dislocation. The surfaces (including crack surfaces) of the bimateral are assumed to be electrically open and magnetically closed. The closed-form analytical solution to the problem is obtained by employing the complex variable approach in conjunction with the conformal mapping technique. The intensity factors of stress, electric displacement and magnetic induction are given explicitly. The obtained results can be used as the Green's function to solve more complicated problems.en_HK
dc.languageengen_HK
dc.publisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.neten_HK
dc.relation.ispartofKey Engineering Materialsen_HK
dc.rightsKey Engineering Materials. Copyright © Trans Tech Publications Ltd.en_HK
dc.subjectBimaterialen_HK
dc.subjectIntensity factorsen_HK
dc.subjectInterfacial cracken_HK
dc.subjectMagnetoelectroelasticityen_HK
dc.titleMode III interfacial edge crack in a magnetoelectroelastic bimaterialen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1013-9826&volume=261-263&spage=393&epage=398&date=2004&atitle=Mode+III+interfacial+edge+crack+in+a+magnetoelectroelastic+bimaterialen_HK
dc.identifier.emailSoh, AK:aksoh@hkucc.hku.hken_HK
dc.identifier.authoritySoh, AK=rp00170en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-3142731464en_HK
dc.identifier.hkuros88995en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-3142731464&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume261-263en_HK
dc.identifier.issueIen_HK
dc.identifier.spage393en_HK
dc.identifier.epage398en_HK
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridSoh, AK=7006795203en_HK
dc.identifier.scopusauthoridLiu, JX=36063914500en_HK
dc.identifier.issnl1013-9826-

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