Showing results 5 to 16 of 16
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| Title | Author(s) | Issue Date | Views | |
|---|---|---|---|---|
Handling of multi-reflections in wafer bump 3D reconstruction Proceeding/Conference:Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics | 2008 | 193 | ||
Height inspection of wafer bumps without explicit 3-D reconstruction Journal:IEEE Transactions on Electronics Packaging Manufacturing | 2010 | 175 | ||
Height inspection of wafer bumps without explicit 3D reconstruction Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2006 | 136 | ||
A novel design of grating projection system for 3D reconstruction of wafer bumps Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2006 | 117 | ||
Optimization of bit-pairing codification with learning for 3D reconstruction Journal:International Journal of Image and Graphics | 2007 | 99 | ||
Projection optics design for tilted projection of fringe patterns Journal:Optical Engineering | 2008 | 188 | ||
Reference-free detection of semiconductor assembly defect Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | 170 | ||
Reference-free machine vision inspection of semiconductor die images Journal:International Journal of Image and Graphics | 2009 | 131 | ||
Structured light-based 3D reconstruction for device with a tiny size Proceeding/Conference:European Conference on Computer Vision's 2nd Workshop on Applications of Computer Vision | 2006 | 90 | ||
Surface orientation recovery of specular micro-surface via binary pattern projection Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2006 | 173 | ||
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | 177 | ||
Use of paraplanar constraint for parallel inspection of wafer bump heights Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007 | 2007 | 82 |