File Download
  Links for fulltext
     (May Require Subscription)
Supplementary

Conference Paper: Thermoresistive characteristics of sintered inkjet printed gold nanoparticle microstructures

TitleThermoresistive characteristics of sintered inkjet printed gold nanoparticle microstructures
Authors
Issue Date2012
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000662
Citation
The 11th IEEE Sensors Conference (SENSORS 2012), Taipei, Taiwan, 28-31 October 2012. In IEEE Sensors Proceedings, 2012, p. 1-4 How to Cite?
AbstractThis paper presents the thermoresistive characteristics of hexanethiol encapsulated gold nanoparticles (NPs), inkjet printed onto Corning 0215 glass and sintered in air. The use of organic encapsulated metal NP precursors enables the growing field inkjet printed microsystems to build low-cost sensors and actuators on non-traditional substrates. However, this technology requires post-deposition thermal steps to sublimate organics and induce NP sintering. The resulting microstructures can have unique characteristics, giving rise to new sensing capabilities. Gold NP microstructures were patterned using inkjet printing and sintered under varied conditions. Four-point resistance measurements were performed on a hotplate to characterize the thermoresistive response of the resulting microstructures between 25°C and 150°C. Temperature coefficients of resistance (TCR) of 2000 and 2300 ppm/°C±10% have been measured for Au-NP films sintered at 175 and 225°C, respectively. © 2012 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/182371
ISBN
References

 

DC FieldValueLanguage
dc.contributor.authorRoberts, RCen_US
dc.contributor.authorTien, NCen_US
dc.date.accessioned2013-04-23T08:20:54Z-
dc.date.available2013-04-23T08:20:54Z-
dc.date.issued2012en_US
dc.identifier.citationThe 11th IEEE Sensors Conference (SENSORS 2012), Taipei, Taiwan, 28-31 October 2012. In IEEE Sensors Proceedings, 2012, p. 1-4en_US
dc.identifier.isbn978-1-4577-1767-3-
dc.identifier.urihttp://hdl.handle.net/10722/182371-
dc.description.abstractThis paper presents the thermoresistive characteristics of hexanethiol encapsulated gold nanoparticles (NPs), inkjet printed onto Corning 0215 glass and sintered in air. The use of organic encapsulated metal NP precursors enables the growing field inkjet printed microsystems to build low-cost sensors and actuators on non-traditional substrates. However, this technology requires post-deposition thermal steps to sublimate organics and induce NP sintering. The resulting microstructures can have unique characteristics, giving rise to new sensing capabilities. Gold NP microstructures were patterned using inkjet printing and sintered under varied conditions. Four-point resistance measurements were performed on a hotplate to characterize the thermoresistive response of the resulting microstructures between 25°C and 150°C. Temperature coefficients of resistance (TCR) of 2000 and 2300 ppm/°C±10% have been measured for Au-NP films sintered at 175 and 225°C, respectively. © 2012 IEEE.en_US
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000662-
dc.relation.ispartofIEEE Sensors Proceedingsen_US
dc.titleThermoresistive characteristics of sintered inkjet printed gold nanoparticle microstructuresen_US
dc.typeConference_Paperen_US
dc.identifier.emailRoberts, RC: rcr8@hku.hken_US
dc.identifier.emailTien, NC: nctien@hku.hk-
dc.identifier.authorityRoberts, RC=rp01738en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/ICSENS.2012.6411374en_US
dc.identifier.scopuseid_2-s2.0-84873958910en_US
dc.identifier.hkuros222870-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-84873958910&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage1-
dc.identifier.epage4-
dc.publisher.placeUnited States-
dc.identifier.scopusauthoridTien, NC=55277995000en_US
dc.identifier.scopusauthoridRoberts, RC=24466830100en_US
dc.customcontrol.immutablesml 131023-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats