Showing results 1 to 2 of 2
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies Proceeding/Conference:IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD | 2009 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |