Showing results 1 to 2 of 2
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration Proceeding/Conference:2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010 | 2010 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |