Showing results 1 to 3 of 3
| Title | Author(s) | Issue Date | Views | |
|---|---|---|---|---|
Atomistic simulations of stress and microstructure evolution during polycrystalline Ni film growth Journal:Physical Review B - Condensed Matter and Materials Physics | 2009 | 3 | ||
Physical origins of intrinsic stresses in Volmer-Weber thin films Journal:MRS Bulletin | 2002 | 4 | ||
Thin film compressive stresses due to adatom insertion into grain boundaries Journal:Physical Review Letters | 2007 |