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	Title	Author(s)	Issue Date
	Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget Journal:Nature Communications	He, Chuan Zhou, Jingzhuo Zhou, Rui Chen, Cong Jing, Siyi Mu, Kaiyu Huang, Yu Ting Chung, Chih Chun Cherng, Sheng Jye Lu, Yang Tu, King Ning Feng, Shien Ping	17-Aug-2024

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