Showing results 1 to 3 of 3
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Beyond Thermal Management: Incorporating p-Diamond Back-Barriers and Cap Layers into AlGaN/GaN HEMTs Journal:IEEE Transactions on Electron Devices | 2016 | ||
GaN HEMTs with multi-functional p-diamond back-barriers Proceeding/Conference:Proceedings of the International Symposium on Power Semiconductor Devices and ICs | 2016 | ||
Recent Development in 2D and 3D GaN devices for RF and Power Electronics Applications Proceeding/Conference:2020 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2020 | 2020 |