Showing results 1 to 2 of 2
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Atomistic simulations of stress and microstructure evolution during polycrystalline Ni film growth Journal:Physical Review B - Condensed Matter and Materials Physics | 2009 | ||
Thin film compressive stresses due to adatom insertion into grain boundaries Journal:Physical Review Letters | 2007 |