Making next-generation AI hardware with emerging soft electronics
Grant Data
Project Title
Making next-generation AI hardware with emerging soft electronics
Principal Investigator
Dr Dai, Shilei
(Principal Investigator (PI))
Duration
36
Start Date
2023-05-21
Amount
13130
Conference Title
Making next-generation AI hardware with emerging soft electronics
Keywords
Making, next-generation, AI, hardware, electronics
Discipline
Materials SciencesElectronics
Panel
Engineering (E)
HKU Project Code
PDFS2324-7S07
Grant Type
RGC Postdoctoral Fellowship Scheme 2023/24
Funding Year
2023
Status
On-going
Objectives
Develop a stretchable and biocompatible ionic electronic mixed semiconductor (IEMS) with performance on par with state-of-the-art non-deformable IEMSs.Figure out the relation of device structures with the performance evolution of IEMS-based neuromorphic devices and sensors during deformation.Establish reliable large-scale neuromorphic and sensor device array fabrication and integration methods.Construct prototype trainable deformation-insensitive neuromorphic in-sensor and nears-sensor computing chips and verify the application potential in the real world.