Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits

View Statistics Email Alert RSS Feed

Grant Data
Project Title
Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
Principal Investigator
Professor Li, Lain-Jong   (Project Coordinator (PC))
Co-Investigator(s)
Professor Feng Shien Ping Tony   (Co-principal investigator)
Professor Huang Mingxin   (Co-principal investigator)
Professor Lee Wei-Ning   (Co-principal investigator)
Professor Xiang Chao   (Co-principal investigator)
Professor Zhao Ni   (Co-principal investigator)
Duration
60
Start Date
2023-11-01
Amount
33406664
Conference Title
Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
Keywords
Copper Hybrid Bonding, Advanced Three-Dimensional Integrated Circuits
Discipline
ElectronicsMaterials Sciences
Panel
Engineering (E)
HKU Project Code
T46-705/23-R
Grant Type
Theme-based Research Scheme 13th Round
Funding Year
2023
Status
On-going
Objectives
Refer to hard copy