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Article: Optoelectronic packaging using silicon surface-micromachined alignment mirrors

TitleOptoelectronic packaging using silicon surface-micromachined alignment mirrors
Authors
Solgaard, ODaneman, MTien, NCFriedberger, AMuller, RSLau, KY
Issue Date1995
Citation
Ieee Photonics Technology Letters, 1995, v. 7 n. 1, p. 41-43 How to Cite?
DOI: http://dx.doi.org/10.1109/68.363382
AbstractWe describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-fiber (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 μm, and we achieve repeatable 45% coupling efficiency with good mechanical stability.
Persistent Identifierhttp://hdl.handle.net/10722/148927
ISSN
1041-1135
2023 Impact Factor: 2.3
2023 SCImago Journal Rankings: 0.684
ISI Accession Number ID
WOS:A1995QD67300014

 

DC FieldValueLanguage
dc.contributor.authorSolgaard, Oen_HK
dc.contributor.authorDaneman, Men_HK
dc.contributor.authorTien, NCen_HK
dc.contributor.authorFriedberger, Aen_HK
dc.contributor.authorMuller, RSen_HK
dc.contributor.authorLau, KYen_HK
dc.date.accessioned2012-06-20T06:16:51Z-
dc.date.available2012-06-20T06:16:51Z-
dc.date.issued1995en_HK
dc.identifier.citationIeee Photonics Technology Letters, 1995, v. 7 n. 1, p. 41-43en_HK
dc.identifier.issn1041-1135en_HK
dc.identifier.urihttp://hdl.handle.net/10722/148927-
dc.description.abstractWe describe a batch-assembled optoelectronic packaging technology based on silicon surface-micromachined alignment mirrors and demonstrate that these mechanical structures have the functionality, stability and accuracy required for active semiconductor laser-to-fiber (single mode) coupling. In initial experiments, we measure an open-loop position accuracy of 0.2 μm, and we achieve repeatable 45% coupling efficiency with good mechanical stability.en_HK
dc.languageengen_US
dc.relation.ispartofIEEE Photonics Technology Lettersen_HK
dc.titleOptoelectronic packaging using silicon surface-micromachined alignment mirrorsen_HK
dc.typeArticleen_HK
dc.identifier.emailTien, NC: nctien@hku.hken_HK
dc.identifier.authorityTien, NC=rp01604en_HK
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/68.363382en_HK
dc.identifier.scopuseid_2-s2.0-0029185146en_HK
dc.identifier.volume7en_HK
dc.identifier.issue1en_HK
dc.identifier.spage41en_HK
dc.identifier.epage43en_HK
dc.identifier.isiWOS:A1995QD67300014-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridSolgaard, O=7005609097en_HK
dc.identifier.scopusauthoridDaneman, M=7003552202en_HK
dc.identifier.scopusauthoridTien, NC=7006532826en_HK
dc.identifier.scopusauthoridFriedberger, A=6601907426en_HK
dc.identifier.scopusauthoridMuller, RS=7404245946en_HK
dc.identifier.scopusauthoridLau, KY=7401559989en_HK
dc.identifier.issnl1041-1135-

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