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Article: Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating
Title | Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating |
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Authors | |
Issue Date | 2000 |
Publisher | I E E E. The Journal's web site is located at http://www.ims2006.org |
Citation | Ieee Mtt-S International Microwave Symposium Digest, 2000, v. 1, p. 279-282 How to Cite? |
Abstract | Polysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities in the silicon substrate beneath. The metallization process simultaneously coated the inner surfaces of the cavities with Cu to form both good radio-frequency (RF) ground and electromagnetic shield. Quality factor (Q) up to 30 and self-resonance frequency (f res) higher than 10 GHz were achieved for a 10.4-nH inductor. Simulation showed that the Cu-lined cavities reduced the mutual inductance between two adjacent inductors by a factor of 5, compared with that without the cavities. This proves that good shielding was provided by the cavities. |
Persistent Identifier | http://hdl.handle.net/10722/148937 |
ISSN | 2023 SCImago Journal Rankings: 0.504 |
References |
DC Field | Value | Language |
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dc.contributor.author | Jiang, H | en_HK |
dc.contributor.author | Wang, Y | en_HK |
dc.contributor.author | Yeh, JLA | en_HK |
dc.contributor.author | Tien, NC | en_HK |
dc.date.accessioned | 2012-06-20T06:16:55Z | - |
dc.date.available | 2012-06-20T06:16:55Z | - |
dc.date.issued | 2000 | en_HK |
dc.identifier.citation | Ieee Mtt-S International Microwave Symposium Digest, 2000, v. 1, p. 279-282 | en_HK |
dc.identifier.issn | 0149-645X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/148937 | - |
dc.description.abstract | Polysilicon spiral inductors encapsulated with copper (Cu) were suspended over 30-μm-deep cavities in the silicon substrate beneath. The metallization process simultaneously coated the inner surfaces of the cavities with Cu to form both good radio-frequency (RF) ground and electromagnetic shield. Quality factor (Q) up to 30 and self-resonance frequency (f res) higher than 10 GHz were achieved for a 10.4-nH inductor. Simulation showed that the Cu-lined cavities reduced the mutual inductance between two adjacent inductors by a factor of 5, compared with that without the cavities. This proves that good shielding was provided by the cavities. | en_HK |
dc.language | eng | en_US |
dc.publisher | I E E E. The Journal's web site is located at http://www.ims2006.org | en_HK |
dc.relation.ispartof | IEEE MTT-S International Microwave Symposium Digest | en_HK |
dc.title | Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Tien, NC: nctien@hku.hk | en_HK |
dc.identifier.authority | Tien, NC=rp01604 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.scopus | eid_2-s2.0-0033709718 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-0033709718&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 1 | en_HK |
dc.identifier.spage | 279 | en_HK |
dc.identifier.epage | 282 | en_HK |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Jiang, H=36120322000 | en_HK |
dc.identifier.scopusauthorid | Wang, Y=7601495931 | en_HK |
dc.identifier.scopusauthorid | Yeh, JLA=7201895883 | en_HK |
dc.identifier.scopusauthorid | Tien, NC=7006532826 | en_HK |
dc.identifier.issnl | 0149-645X | - |