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Conference Paper: Electromagnetically shielded high-Q CMOS-compatible copper inductors
Title | Electromagnetically shielded high-Q CMOS-compatible copper inductors |
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Authors | |
Issue Date | 2000 |
Citation | Digest Of Technical Papers - Ieee International Solid-State Circuits Conference, 2000, p. 330-331 How to Cite? |
Abstract | An on-chip suspended high electromagnetically shielded spiral inductor was fabricated using silicon micromachining techniques. The inductor comprises of a polysilicon spiral electrolessly plated with copper. Silicon nitride layer was deposited as an isolation layer on the inductor and sacrificial oxide blocks were created in the silicon substrate. The structure was released in hydrofluoric acid and electroless copper plating was performed. |
Persistent Identifier | http://hdl.handle.net/10722/148996 |
ISSN | 2023 SCImago Journal Rankings: 3.827 |
References |
DC Field | Value | Language |
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dc.contributor.author | Jiang, H | en_HK |
dc.contributor.author | JerLiang Andrew Yeh | en_HK |
dc.contributor.author | Wang, Y | en_HK |
dc.contributor.author | Tien, N | en_HK |
dc.date.accessioned | 2012-06-20T06:17:45Z | - |
dc.date.available | 2012-06-20T06:17:45Z | - |
dc.date.issued | 2000 | en_HK |
dc.identifier.citation | Digest Of Technical Papers - Ieee International Solid-State Circuits Conference, 2000, p. 330-331 | en_US |
dc.identifier.issn | 0193-6530 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/148996 | - |
dc.description.abstract | An on-chip suspended high electromagnetically shielded spiral inductor was fabricated using silicon micromachining techniques. The inductor comprises of a polysilicon spiral electrolessly plated with copper. Silicon nitride layer was deposited as an isolation layer on the inductor and sacrificial oxide blocks were created in the silicon substrate. The structure was released in hydrofluoric acid and electroless copper plating was performed. | en_HK |
dc.language | eng | en_US |
dc.relation.ispartof | Digest of Technical Papers - IEEE International Solid-State Circuits Conference | en_HK |
dc.title | Electromagnetically shielded high-Q CMOS-compatible copper inductors | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.email | Tien, N: nctien@hku.hk | en_HK |
dc.identifier.authority | Tien, N=rp01604 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.scopus | eid_2-s2.0-0034428326 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-0034428326&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.spage | 330 | en_HK |
dc.identifier.epage | 331 | en_HK |
dc.publisher.place | United States | en_HK |
dc.identifier.scopusauthorid | Jiang, H=36120322000 | en_HK |
dc.identifier.scopusauthorid | JerLiang Andrew Yeh=7409531654 | en_HK |
dc.identifier.scopusauthorid | Wang, Y=7601495931 | en_HK |
dc.identifier.scopusauthorid | Tien, N=7006532826 | en_HK |
dc.identifier.issnl | 0193-6530 | - |