File Download
There are no files associated with this item.
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1016/S0045-7949(02)00060-3
- Scopus: eid_2-s2.0-0036563680
- WOS: WOS:000177479000004
- Find via
Supplementary
- Citations:
- Appears in Collections:
Article: The exact solution of coupled thermoelectroelastic behavior of piezoelectric laminates
Title | The exact solution of coupled thermoelectroelastic behavior of piezoelectric laminates |
---|---|
Authors | |
Keywords | Composite Exact Solution Laminate Piezoelectric Thermoelectroelastic Trigonometric Series |
Issue Date | 2002 |
Publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/compstruc |
Citation | Computers And Structures, 2002, v. 80 n. 13, p. 1201-1212 How to Cite? |
Abstract | Exact solutions for static analysis of thermoelectroelastic laminated plates are presented. In this analysis, a new concise procedure for the analytical solution of composite laminated plates with piezoelectric layers is developed. A simple eigenvalue formula in real number form is directly developed from the basic coupled piezoelectric differential equations and the difficulty of treating imaginary eigenvalues is avoided. The solution is defined in the trigonometric series and can be applied to thin and thick plates. Numerical studies are conducted on a five-layer piezoelectric plate and the complexity of stresses and deformations under combined loading is illustrated. The results presented here could be used as a benchmark for assessing any numerical solution by approximate approaches such as the finite element method while also providing useful physical insight into the behavior of piezoelectric plates in thermal environment. © 2002 Elsevier Science Ltd. All rights reserved. |
Persistent Identifier | http://hdl.handle.net/10722/150215 |
ISSN | 2023 Impact Factor: 4.4 2023 SCImago Journal Rankings: 1.274 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zhang, C | en_US |
dc.contributor.author | Cheung, YK | en_US |
dc.contributor.author | Di, S | en_US |
dc.contributor.author | Zhang, N | en_US |
dc.date.accessioned | 2012-06-26T06:02:27Z | - |
dc.date.available | 2012-06-26T06:02:27Z | - |
dc.date.issued | 2002 | en_US |
dc.identifier.citation | Computers And Structures, 2002, v. 80 n. 13, p. 1201-1212 | en_US |
dc.identifier.issn | 0045-7949 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/150215 | - |
dc.description.abstract | Exact solutions for static analysis of thermoelectroelastic laminated plates are presented. In this analysis, a new concise procedure for the analytical solution of composite laminated plates with piezoelectric layers is developed. A simple eigenvalue formula in real number form is directly developed from the basic coupled piezoelectric differential equations and the difficulty of treating imaginary eigenvalues is avoided. The solution is defined in the trigonometric series and can be applied to thin and thick plates. Numerical studies are conducted on a five-layer piezoelectric plate and the complexity of stresses and deformations under combined loading is illustrated. The results presented here could be used as a benchmark for assessing any numerical solution by approximate approaches such as the finite element method while also providing useful physical insight into the behavior of piezoelectric plates in thermal environment. © 2002 Elsevier Science Ltd. All rights reserved. | en_US |
dc.language | eng | en_US |
dc.publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/compstruc | en_US |
dc.relation.ispartof | Computers and Structures | en_US |
dc.subject | Composite | en_US |
dc.subject | Exact Solution | en_US |
dc.subject | Laminate | en_US |
dc.subject | Piezoelectric | en_US |
dc.subject | Thermoelectroelastic | en_US |
dc.subject | Trigonometric Series | en_US |
dc.title | The exact solution of coupled thermoelectroelastic behavior of piezoelectric laminates | en_US |
dc.type | Article | en_US |
dc.identifier.email | Cheung, YK:hreccyk@hkucc.hku.hk | en_US |
dc.identifier.authority | Cheung, YK=rp00104 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.doi | 10.1016/S0045-7949(02)00060-3 | en_US |
dc.identifier.scopus | eid_2-s2.0-0036563680 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-0036563680&selection=ref&src=s&origin=recordpage | en_US |
dc.identifier.volume | 80 | en_US |
dc.identifier.issue | 13 | en_US |
dc.identifier.spage | 1201 | en_US |
dc.identifier.epage | 1212 | en_US |
dc.identifier.isi | WOS:000177479000004 | - |
dc.publisher.place | United Kingdom | en_US |
dc.identifier.scopusauthorid | Zhang, C=7405490089 | en_US |
dc.identifier.scopusauthorid | Cheung, YK=7202111065 | en_US |
dc.identifier.scopusauthorid | Di, S=7006099854 | en_US |
dc.identifier.scopusauthorid | Zhang, N=7401648302 | en_US |
dc.identifier.issnl | 0045-7949 | - |