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Article: Motion simulation using solid models

TitleMotion simulation using solid models
Authors
Yuen, MMFSze, WSTan, STLi, NC
Issue Date1988
Citation
Hong Kong Engineer, 1988, v. 16 n. 10, p. 27-30 How to Cite?
AbstractThis paper is one in a series on CAD/CAM technology. It emphasizes application of solid modelling technique to motion simulation of engineering assemblies and mechanisms. The technique allows designers to generate swept volume of an assembly and to check possible collision with obstacles or other parts of the assembly. Examples of application areas are robot path simulation, engineering assembly design etc. This paper describes the basic theory behind the subject, illustrating its application with simple examples.
Persistent Identifierhttp://hdl.handle.net/10722/156327
ISSN
0378-8776
2019 SCImago Journal Rankings: 0.125

 

DC FieldValueLanguage
dc.contributor.authorYuen, MMFen_US
dc.contributor.authorSze, WSen_US
dc.contributor.authorTan, STen_US
dc.contributor.authorLi, NCen_US
dc.date.accessioned2012-08-08T08:42:00Z-
dc.date.available2012-08-08T08:42:00Z-
dc.date.issued1988en_US
dc.identifier.citationHong Kong Engineer, 1988, v. 16 n. 10, p. 27-30en_US
dc.identifier.issn0378-8776en_US
dc.identifier.urihttp://hdl.handle.net/10722/156327-
dc.description.abstractThis paper is one in a series on CAD/CAM technology. It emphasizes application of solid modelling technique to motion simulation of engineering assemblies and mechanisms. The technique allows designers to generate swept volume of an assembly and to check possible collision with obstacles or other parts of the assembly. Examples of application areas are robot path simulation, engineering assembly design etc. This paper describes the basic theory behind the subject, illustrating its application with simple examples.en_US
dc.languageengen_US
dc.relation.ispartofHong Kong engineeren_US
dc.titleMotion simulation using solid modelsen_US
dc.typeArticleen_US
dc.identifier.emailSze, WS:wssze@hkucc.hku.hken_US
dc.identifier.emailTan, ST:sttan@hkucc.hku.hken_US
dc.identifier.authoritySze, WS=rp00172en_US
dc.identifier.authorityTan, ST=rp00174en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.scopuseid_2-s2.0-0024091109en_US
dc.identifier.volume16en_US
dc.identifier.issue10en_US
dc.identifier.spage27en_US
dc.identifier.epage30en_US
dc.identifier.scopusauthoridYuen, MMF=7102031967en_US
dc.identifier.scopusauthoridSze, WS=7003795945en_US
dc.identifier.scopusauthoridTan, ST=7403366758en_US
dc.identifier.scopusauthoridLi, NC=7403608733en_US
dc.identifier.issnl0378-8776-

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