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Article: Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides
Title | Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides |
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Authors | |
Keywords | Epoxy resin Hydroxyl-containing diamine Reactive polyimide Thermal stability |
Issue Date | 2012 |
Publisher | Springer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760 |
Citation | Journal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 How to Cite? |
Abstract | Novel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012. |
Persistent Identifier | http://hdl.handle.net/10722/159748 |
ISSN | 2023 Impact Factor: 2.6 2023 SCImago Journal Rankings: 0.462 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Shen, J | en_HK |
dc.contributor.author | Zhang, Y | en_HK |
dc.contributor.author | Huang, M | en_HK |
dc.contributor.author | Wang, W | en_HK |
dc.contributor.author | Xu, Z | en_HK |
dc.contributor.author | Yeung, KWK | en_HK |
dc.contributor.author | Yi, C | en_HK |
dc.contributor.author | Xu, M | en_HK |
dc.date.accessioned | 2012-08-16T05:55:30Z | - |
dc.date.available | 2012-08-16T05:55:30Z | - |
dc.date.issued | 2012 | en_HK |
dc.identifier.citation | Journal Of Polymer Research, 2012, v. 19 n. 5, article no. 9857 | en_HK |
dc.identifier.issn | 1022-9760 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/159748 | - |
dc.description.abstract | Novel reactive polyimides (PIs) containing phenolic hydroxyl functionalities were prepared from 4-(4-hydroxyphenyl)-2,6-bis[3-(4- aminophenoxy)phenyl]pyri-dine (m,p-HAPP) with various aromatic dianhydrides via one-step polycondensation procedure. The inherent viscosities of the PIs were 0.54-0.63 dL/g in DMF solution and most of them were readily soluble in common organic solvents such as DMF, DMAc, NMP, and m-Cresol, etc. Meanwhile, the PIs also had good thermal stability, with the glass transition temperature (T g) of 221.7-310.5 °C, the temperature at 10 % weight loss of 524.1-579.3 °C in nitrogen atmosphere. Then commercial epoxy resin was cured in the presence of different ratios of the reactive polyimide, giving a series of polyimide modified epoxy films. Thermogravimetric analysis showed the increase of the temperature at 5 % weight loss of the films with the increase of the polyimide content; 296 °C for 0 %, 309 °C for 1.95 %, 337 °C for 3.85 % and 350 °C for 5.63 %. © Springer Science+Business Media B.V. 2012. | en_HK |
dc.language | eng | en_US |
dc.publisher | Springer Verlag Dordrecht. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=1022-9760 | en_HK |
dc.relation.ispartof | Journal of Polymer Research | en_HK |
dc.subject | Epoxy resin | en_HK |
dc.subject | Hydroxyl-containing diamine | en_HK |
dc.subject | Reactive polyimide | en_HK |
dc.subject | Thermal stability | en_HK |
dc.title | Study on preparation and properties of novel reactive phenolic hydroxyl-containing polyimides | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Yeung, KWK:wkkyeung@hkucc.hku.hk | en_HK |
dc.identifier.authority | Yeung, KWK=rp00309 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1007/s10965-012-9857-x | en_HK |
dc.identifier.scopus | eid_2-s2.0-84859447955 | en_HK |
dc.identifier.hkuros | 204524 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-84859447955&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 19 | en_HK |
dc.identifier.issue | 5 | en_HK |
dc.identifier.isi | WOS:000304135400003 | - |
dc.publisher.place | Netherlands | en_HK |
dc.identifier.scopusauthorid | Shen, J=55080338600 | en_HK |
dc.identifier.scopusauthorid | Zhang, Y=55177389800 | en_HK |
dc.identifier.scopusauthorid | Huang, M=37039163300 | en_HK |
dc.identifier.scopusauthorid | Wang, W=53980654200 | en_HK |
dc.identifier.scopusauthorid | Xu, Z=12760201200 | en_HK |
dc.identifier.scopusauthorid | Yeung, KWK=13309584700 | en_HK |
dc.identifier.scopusauthorid | Yi, C=7101997365 | en_HK |
dc.identifier.scopusauthorid | Xu, M=15123314800 | en_HK |
dc.identifier.citeulike | 10636640 | - |
dc.customcontrol.immutable | jt 130429 | - |
dc.identifier.issnl | 1022-9760 | - |