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Article: Strain and temperature dependence of deformation banding
Title | Strain and temperature dependence of deformation banding |
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Authors | |
Issue Date | 1994 |
Publisher | Trans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net |
Citation | Materials Science Forum, 1994, v. 157-6 pt 1, p. 801-806 How to Cite? |
Abstract | In the rolling of wedge shaped copper specimens of different grain sizes, the strain at which deformation banding become discernible is found to be dependent on grain size and rolling temperature. Utilizing SEM micrographs of crystallographically etched samples, statistical analysis of sheet plane and longitudinal sections were conducted to better understand the onset of deformation banding. The orientation dependency of deformation banding are found to be complex. The effect of temperature was studied by rolling the samples at 300 °C in a single pass to 50% of original thickness. Complex microstructures were observed and with the aid of Electron Back Scattering Pattern (EBSP) technique, the result put forward a new approach in the study of the evolution of deformation texture. |
Persistent Identifier | http://hdl.handle.net/10722/174044 |
ISSN | 2023 SCImago Journal Rankings: 0.195 |
DC Field | Value | Language |
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dc.contributor.author | Lim, E | en_US |
dc.contributor.author | Greene, GW | en_US |
dc.contributor.author | Duggan, BJ | en_US |
dc.date.accessioned | 2012-11-14T06:20:23Z | - |
dc.date.available | 2012-11-14T06:20:23Z | - |
dc.date.issued | 1994 | en_US |
dc.identifier.citation | Materials Science Forum, 1994, v. 157-6 pt 1, p. 801-806 | en_US |
dc.identifier.issn | 0255-5476 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/174044 | - |
dc.description.abstract | In the rolling of wedge shaped copper specimens of different grain sizes, the strain at which deformation banding become discernible is found to be dependent on grain size and rolling temperature. Utilizing SEM micrographs of crystallographically etched samples, statistical analysis of sheet plane and longitudinal sections were conducted to better understand the onset of deformation banding. The orientation dependency of deformation banding are found to be complex. The effect of temperature was studied by rolling the samples at 300 °C in a single pass to 50% of original thickness. Complex microstructures were observed and with the aid of Electron Back Scattering Pattern (EBSP) technique, the result put forward a new approach in the study of the evolution of deformation texture. | en_US |
dc.language | eng | en_US |
dc.publisher | Trans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net | en_US |
dc.relation.ispartof | Materials Science Forum | en_US |
dc.title | Strain and temperature dependence of deformation banding | en_US |
dc.type | Article | en_US |
dc.identifier.email | Duggan, BJ: bjduggan@hkucc.hku.hk | en_US |
dc.identifier.authority | Duggan, BJ=rp01686 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.scopus | eid_2-s2.0-0028666577 | en_US |
dc.identifier.volume | 157-6 | en_US |
dc.identifier.issue | pt 1 | en_US |
dc.identifier.spage | 801 | en_US |
dc.identifier.epage | 806 | en_US |
dc.publisher.place | Switzerland | en_US |
dc.identifier.scopusauthorid | Lim, E=7201711151 | en_US |
dc.identifier.scopusauthorid | Greene, GW=7102617510 | en_US |
dc.identifier.scopusauthorid | Duggan, BJ=7005772998 | en_US |
dc.identifier.issnl | 0255-5476 | - |