Strain and temperature dependence of deformation banding

Abstract

In the rolling of wedge shaped copper specimens of different grain sizes, the strain at which deformation banding become discernible is found to be dependent on grain size and rolling temperature. Utilizing SEM micrographs of crystallographically etched samples, statistical analysis of sheet plane and longitudinal sections were conducted to better understand the onset of deformation banding. The orientation dependency of deformation banding are found to be complex. The effect of temperature was studied by rolling the samples at 300 °C in a single pass to 50% of original thickness. Complex microstructures were observed and with the aid of Electron Back Scattering Pattern (EBSP) technique, the result put forward a new approach in the study of the evolution of deformation texture.