File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Copper Sludge from Printed Circuit Board Production/Recycling for Ceramic Materials: A Quantitative Analysis of Copper Transformation and Immobilization

TitleCopper Sludge from Printed Circuit Board Production/Recycling for Ceramic Materials: A Quantitative Analysis of Copper Transformation and Immobilization
Authors
Tang, YLee, PHShih, K
Issue Date2013
Citation
Environmental Science & Technology, 2013, v. 47, p. 8609–8615 How to Cite?
DOI: http://dx.doi.org/10.1021/es400404x
Persistent Identifierhttp://hdl.handle.net/10722/188931
ISSN
0013-936X
2021 Impact Factor: 11.357
2020 SCImago Journal Rankings: 2.851
ISI Accession Number ID
WOS:000323013400065

 

DC FieldValueLanguage
dc.contributor.authorTang, Yen_US
dc.contributor.authorLee, PHen_US
dc.contributor.authorShih, Ken_US
dc.date.accessioned2013-09-17T14:20:57Z-
dc.date.available2013-09-17T14:20:57Z-
dc.date.issued2013en_US
dc.identifier.citationEnvironmental Science & Technology, 2013, v. 47, p. 8609–8615en_US
dc.identifier.issn0013-936X-
dc.identifier.urihttp://hdl.handle.net/10722/188931-
dc.languageengen_US
dc.relation.ispartofEnvironmental Science & Technologyen_US
dc.titleCopper Sludge from Printed Circuit Board Production/Recycling for Ceramic Materials: A Quantitative Analysis of Copper Transformation and Immobilizationen_US
dc.typeArticleen_US
dc.identifier.emailTang, Y: tangyuan@hku.hken_US
dc.identifier.emailShih, K: kshih@hkucc.hku.hken_US
dc.identifier.authorityShih, K=rp00167en_US
dc.identifier.doi10.1021/es400404x-
dc.identifier.scopuseid_2-s2.0-84881446768-
dc.identifier.hkuros222360en_US
dc.identifier.volume47en_US
dc.identifier.spage8609en_US
dc.identifier.epage8615en_US
dc.identifier.eissn1520-5851-
dc.identifier.isiWOS:000323013400065-
dc.identifier.issnl0013-936X-

Export via OAI-PMH Interface in XML Formats

OR

Export to Other Non-XML Formats