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Conference Paper: BIMatizing prefabrication housing construction in Hong Kong: Contexts, frameworks, and challenges ahead

TitleBIMatizing prefabrication housing construction in Hong Kong: Contexts, frameworks, and challenges ahead
Authors
Lu, WHuang, GQNg, TSTShen, QPGao, Y
Issue Date2013
PublisherOsaka University Press.
Citation
The 1st International Conference on Civil and Building Engineering Informatics (ICCBEI 2013), Tokyo, Japan, 7-8 November 2013. In the Proceedings of the 1st International Conference on Civil and Building Engineering Informatics, 2013, p. 339-344 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/195936

 

DC FieldValueLanguage
dc.contributor.authorLu, Wen_US
dc.contributor.authorHuang, GQen_US
dc.contributor.authorNg, TSTen_US
dc.contributor.authorShen, QPen_US
dc.contributor.authorGao, Yen_US
dc.date.accessioned2014-03-21T02:23:59Z-
dc.date.available2014-03-21T02:23:59Z-
dc.date.issued2013en_US
dc.identifier.citationThe 1st International Conference on Civil and Building Engineering Informatics (ICCBEI 2013), Tokyo, Japan, 7-8 November 2013. In the Proceedings of the 1st International Conference on Civil and Building Engineering Informatics, 2013, p. 339-344en_US
dc.identifier.urihttp://hdl.handle.net/10722/195936-
dc.languageengen_US
dc.publisherOsaka University Press.-
dc.relation.ispartofProceedings of the 1st International Conference on Civil and Building Engineering Informatics (ICCBEI 2013)en_US
dc.titleBIMatizing prefabrication housing construction in Hong Kong: Contexts, frameworks, and challenges aheaden_US
dc.typeConference_Paperen_US
dc.identifier.emailLu, W: wilsonlu@hku.hken_US
dc.identifier.emailHuang, GQ: gqhuang@hku.hken_US
dc.identifier.emailNg, TST: tstng@hku.hken_US
dc.identifier.emailGao, Y: yangao@hku.hken_US
dc.identifier.authorityLu, W=rp01362en_US
dc.identifier.authorityHuang, GQ=rp00118en_US
dc.identifier.authorityNg, TST=rp00158en_US
dc.identifier.authorityGao, Y=rp01331en_US
dc.identifier.hkuros228269en_US
dc.identifier.spage339en_US
dc.identifier.epage344en_US
dc.publisher.placeJapan-

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