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  Patent History
  • Application
    US 12/3506839 2012-05-18
  • Publication
    US 20120292788 2012-11-22

Patent: Chip stacking

TitleChip stacking
Priority Date2012-05-18 US 12/3506839
2011-05-19 US 12/1487890P
Inventors
Issue Date2012
Citation
US Published patent application US 20120292788. Washington, DC: US Patent and Trademark Office (USPTO), 2012 How to Cite?
AbstractMethods and systems are provided to utilize and manufacture a stacked chip assembly. Microelectronic or optoelectronic chips of any dimensions are directly stacked onto each other. The chips can be of substantially identical sizes. To enable forming the stacked chip assembly, trenches are laser micro-machined onto the bottom surface of a chip to accommodate the bond wedge/ball and wire path of the chip beneath it. Consequently, chips can be tightly integrated without a gap and without having to reserve space for the bond wedges/balls.
Persistent Identifierhttp://hdl.handle.net/10722/197059

 

DC FieldValueLanguage
dc.date.accessioned2014-05-07T06:51:05Z-
dc.date.available2014-05-07T06:51:05Z-
dc.date.issued2012-
dc.identifier.citationUS Published patent application US 20120292788. Washington, DC: US Patent and Trademark Office (USPTO), 2012en_US
dc.identifier.urihttp://hdl.handle.net/10722/197059-
dc.description.abstractMethods and systems are provided to utilize and manufacture a stacked chip assembly. Microelectronic or optoelectronic chips of any dimensions are directly stacked onto each other. The chips can be of substantially identical sizes. To enable forming the stacked chip assembly, trenches are laser micro-machined onto the bottom surface of a chip to accommodate the bond wedge/ball and wire path of the chip beneath it. Consequently, chips can be tightly integrated without a gap and without having to reserve space for the bond wedges/balls.en_US
dc.relation.isreferencedbyUS 2012133908 (A1) 2012-05-31en_US
dc.relation.isreferencedbyUS 8684540 (B2) 2014-04-01en_US
dc.titleChip stackingen_US
dc.typePatenten_US
dc.identifier.authorityCHOI HOI WAI=rp00108en_US
dc.description.naturepublished_or_final_version-
dc.contributor.inventorCHOI HOI WAIen_US
patents.identifier.applicationUS 12/3506839en_US
patents.description.assigneeCHOI HOI WAI [CN]; UNIV HONG KONG [CN]en_US
patents.description.countryUnited States of Americaen_US
patents.date.publication2012-11-22en_US
patents.identifier.hkutechidEEE-2010-00376-1-
patents.date.application2012-05-18en_US
patents.date.priority2012-05-18 US 12/3506839en_US
patents.date.priority2011-05-19 US 12/1487890Pen_US
patents.description.ccusen_US
patents.identifier.publicationUS 20120292788en_US
patents.relation.familyWO 2012155858 (A1) 2012-11-22en_US
patents.relation.familyCN 103650129 (A) 2014-03-19en_US
patents.relation.familyKR 20140013060 (A) 2014-02-04en_US
patents.description.kindA1en_US

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