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Conference Paper: Electrospun bicomponent scaffolds with osteoconductivity and osteoinductivity
Title | Electrospun bicomponent scaffolds with osteoconductivity and osteoinductivity 具有骨传导性和骨引导性的双组分电纺支架:rhBMP-2 的可控缓释与支架的生物学评价 |
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Authors | |
Issue Date | 2013 |
Citation | The 2013 Academic Meeting of the Chinese Society for Biomaterials (CSBM), Shenzhen, China, 20-23 December 2013, 1pp. How to Cite? |
Description | 第35 场 - 专题S35:组织工程与再生材料-3 (ID: 1070) |
Persistent Identifier | http://hdl.handle.net/10722/204204 |
DC Field | Value | Language |
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dc.contributor.author | Wang, C | - |
dc.contributor.author | Wang, M | - |
dc.date.accessioned | 2014-09-19T21:23:45Z | - |
dc.date.available | 2014-09-19T21:23:45Z | - |
dc.date.issued | 2013 | - |
dc.identifier.citation | The 2013 Academic Meeting of the Chinese Society for Biomaterials (CSBM), Shenzhen, China, 20-23 December 2013, 1pp. | - |
dc.identifier.uri | http://hdl.handle.net/10722/204204 | - |
dc.description | 第35 场 - 专题S35:组织工程与再生材料-3 (ID: 1070) | - |
dc.language | chi | - |
dc.relation.ispartof | Proceedings of the CSBM Academic Meeting 2013 | - |
dc.relation.ispartof | 中国生物材料学会2013年大会论文集 | - |
dc.title | Electrospun bicomponent scaffolds with osteoconductivity and osteoinductivity | - |
dc.title | 具有骨传导性和骨引导性的双组分电纺支架:rhBMP-2 的可控缓释与支架的生物学评价 | - |
dc.type | Conference_Paper | - |
dc.identifier.email | Wang, C: adamcw@hku.hk | - |
dc.identifier.email | Wang, M: memwang@hku.hk | - |
dc.identifier.authority | Wang, M=rp00185 | - |
dc.identifier.hkuros | 235497 | - |