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Book Chapter: Quantitative X-Ray Diffraction for Revealing the Thermal Incorporation Behavior of Lead

TitleQuantitative X-Ray Diffraction for Revealing the Thermal Incorporation Behavior of Lead
Authors
Shih, KLu, X
Issue Date2013
PublisherNova Science Publishers, Inc.
Citation
Quantitative X-Ray Diffraction for Revealing the Thermal Incorporation Behavior of Lead. In Shih, K (Ed.), X-Ray Diffraction: Structure, Principles and Applications, p. 135-160. New York: Nova Science Publishers, Inc., 2013 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/205214
ISBN
9781628085914
Series/Report no.Materials Science and Technologies

 

DC FieldValueLanguage
dc.contributor.authorShih, Ken_US
dc.contributor.authorLu, Xen_US
dc.date.accessioned2014-09-20T02:00:37Z-
dc.date.available2014-09-20T02:00:37Z-
dc.date.issued2013-
dc.identifier.citationQuantitative X-Ray Diffraction for Revealing the Thermal Incorporation Behavior of Lead. In Shih, K (Ed.), X-Ray Diffraction: Structure, Principles and Applications, p. 135-160. New York: Nova Science Publishers, Inc., 2013en_US
dc.identifier.isbn9781628085914-
dc.identifier.urihttp://hdl.handle.net/10722/205214-
dc.languageengen_US
dc.publisherNova Science Publishers, Inc.-
dc.relation.ispartofX-Ray Diffraction: Structure, Principles and Applications-
dc.relation.ispartofseriesMaterials Science and Technologies-
dc.titleQuantitative X-Ray Diffraction for Revealing the Thermal Incorporation Behavior of Leaden_US
dc.typeBook_Chapteren_US
dc.identifier.emailShih, K: kshih@hkucc.hku.hken_US
dc.identifier.authorityShih, K=rp00167en_US
dc.identifier.hkuros237163en_US
dc.identifier.spage135en_US
dc.identifier.epage160en_US
dc.publisher.placeNew Yorken_US

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