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Article: Synergetic effect of Bi 2 Te 3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi 2 Te 3 joints

TitleSynergetic effect of Bi 2 Te 3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi 2 Te 3 joints
Authors
Lin, CFHAU, NYHUANG, Y-TCHANG, Y-HFeng, SPTChen, CM
KeywordsDiffusion barrier
Electroplating
Microstructure
Surface modification
Thermoelectric
Issue Date2017
Citation
Journal of Alloys and Compounds, 2017, v. 708, p. 220-230 How to Cite?
DOI: http://dx.doi.org/10.1016/j.jallcom.2017.02.300
Persistent Identifierhttp://hdl.handle.net/10722/245091
ISI Accession Number ID
WOS:000400713300030

 

DC FieldValueLanguage
dc.contributor.authorLin, CF-
dc.contributor.authorHAU, NY-
dc.contributor.authorHUANG, Y-T-
dc.contributor.authorCHANG, Y-H-
dc.contributor.authorFeng, SPT-
dc.contributor.authorChen, CM-
dc.date.accessioned2017-09-18T02:04:27Z-
dc.date.available2017-09-18T02:04:27Z-
dc.date.issued2017-
dc.identifier.citationJournal of Alloys and Compounds, 2017, v. 708, p. 220-230-
dc.identifier.urihttp://hdl.handle.net/10722/245091-
dc.languageeng-
dc.relation.ispartofJournal of Alloys and Compounds-
dc.subjectDiffusion barrier-
dc.subjectElectroplating-
dc.subjectMicrostructure-
dc.subjectSurface modification-
dc.subjectThermoelectric-
dc.titleSynergetic effect of Bi 2 Te 3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi 2 Te 3 joints-
dc.typeArticle-
dc.identifier.emailFeng, SPT: hpfeng@hku.hk-
dc.identifier.authorityFeng, SPT=rp01533-
dc.identifier.doi10.1016/j.jallcom.2017.02.300-
dc.identifier.scopuseid_2-s2.0-85014493614-
dc.identifier.hkuros279242-
dc.identifier.volume708-
dc.identifier.spage220-
dc.identifier.epage230-
dc.identifier.isiWOS:000400713300030-

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