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Conference Paper: Influence of mechanical compression and electrical field on particle-laden interfaces

TitleInfluence of mechanical compression and electrical field on particle-laden interfaces
Authors
Liu, ZFu, XBinks, BPShum, HC
Issue Date2015
PublisherThe Hong Kong University of Science and Technology.
Citation
Gordon Research Conference- Nano-Mechanical Interfaces, Hong Kong, 2015 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/256133

 

DC FieldValueLanguage
dc.contributor.authorLiu, Z-
dc.contributor.authorFu, X-
dc.contributor.authorBinks, BP-
dc.contributor.authorShum, HC-
dc.date.accessioned2018-07-18T08:54:40Z-
dc.date.available2018-07-18T08:54:40Z-
dc.date.issued2015-
dc.identifier.citationGordon Research Conference- Nano-Mechanical Interfaces, Hong Kong, 2015-
dc.identifier.urihttp://hdl.handle.net/10722/256133-
dc.languageeng-
dc.publisherThe Hong Kong University of Science and Technology. -
dc.relation.ispartofGordon Research Conference- Nano-Mechanical Interfaces-
dc.titleInfluence of mechanical compression and electrical field on particle-laden interfaces-
dc.typeConference_Paper-
dc.identifier.emailFu, X: xyfu@HKUCC-COM.hku.hk-
dc.identifier.emailShum, HC: ashum@hku.hk-
dc.identifier.authorityShum, HC=rp01439-
dc.identifier.hkuros250869-
dc.publisher.placeHong Kong-

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