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Article: Toward integrated plasmonic circuits

TitleToward integrated plasmonic circuits
Authors
KeywordsMicrostructure
optical properties
optical
mixture
devices
Issue Date2012
Citation
MRS Bulletin, 2012, v. 37, n. 8, p. 728-738 How to Cite?
AbstractEmerging telecommunication and data routing applications anticipate a photonic roadmap leading to ultra-compact photonic integrated circuits. Consequently, photonic devices will soon have to meet footprint and efficiency requirements similar to their electronic counterparts calling for extreme capabilities to create, guide, modulate, and detect deep-subwavelength optical fields. For active devices such as modulators, this means fulfilling optical switching operations within light propagation distances of just a few wavelengths. Plasmonics, or metal optics, has emerged as one potential solution for integrated on-chip circuits that can combine both high operational speeds and ultra-compact architectures rivaling electronics in both speed and critical feature sizes. This article describes the current status, challenges, and future directions of the various components required to realize plasmonic integrated circuitry. © 2012 Materials Research Society.
Persistent Identifierhttp://hdl.handle.net/10722/257117
ISSN
2020 Impact Factor: 6.578
2015 SCImago Journal Rankings: 3.340
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorSorger, Volker J.-
dc.contributor.authorOulton, Rupert F.-
dc.contributor.authorMa, Ren Min-
dc.contributor.authorZhang, Xiang-
dc.date.accessioned2018-07-24T08:58:53Z-
dc.date.available2018-07-24T08:58:53Z-
dc.date.issued2012-
dc.identifier.citationMRS Bulletin, 2012, v. 37, n. 8, p. 728-738-
dc.identifier.issn0883-7694-
dc.identifier.urihttp://hdl.handle.net/10722/257117-
dc.description.abstractEmerging telecommunication and data routing applications anticipate a photonic roadmap leading to ultra-compact photonic integrated circuits. Consequently, photonic devices will soon have to meet footprint and efficiency requirements similar to their electronic counterparts calling for extreme capabilities to create, guide, modulate, and detect deep-subwavelength optical fields. For active devices such as modulators, this means fulfilling optical switching operations within light propagation distances of just a few wavelengths. Plasmonics, or metal optics, has emerged as one potential solution for integrated on-chip circuits that can combine both high operational speeds and ultra-compact architectures rivaling electronics in both speed and critical feature sizes. This article describes the current status, challenges, and future directions of the various components required to realize plasmonic integrated circuitry. © 2012 Materials Research Society.-
dc.languageeng-
dc.relation.ispartofMRS Bulletin-
dc.subjectMicrostructure-
dc.subjectoptical properties-
dc.subjectoptical-
dc.subjectmixture-
dc.subjectdevices-
dc.titleToward integrated plasmonic circuits-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1557/mrs.2012.170-
dc.identifier.scopuseid_2-s2.0-84865277140-
dc.identifier.volume37-
dc.identifier.issue8-
dc.identifier.spage728-
dc.identifier.epage738-
dc.identifier.isiWOS:000308083700009-
dc.identifier.issnl0883-7694-

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