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- Publisher Website: 10.1103/PhysRevLett.89.215509
- Scopus: eid_2-s2.0-0037132290
- PMID: 12443431
- WOS: WOS:000179068000038
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Article: Morphological Instability and Additive-Induced Stabilization in Electrodeposition
Title | Morphological Instability and Additive-Induced Stabilization in Electrodeposition |
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Authors | |
Issue Date | 2002 |
Citation | Physical Review Letters, 2002, v. 89, n. 21, article no. 215509 How to Cite? |
Abstract | Experiments show that electrodeposited (ED) films exhibit rough surfaces unless the electrochemical bath contains small quantities of molecular “additive” species. We develop a model for ED with additives which shows the suppression of the morphological instability by preferential additive accumulation near surface protrusions due to complex formation and additive codeposition, and subsequent growth site blocking. Linearly stable growth can be achieved over a wide range of deposition flux at sufficiently large additive bulk concentration. We predict the growth conditions necessary for level surfaces, in good agreement with experiments. © 2002 The American Physical Society. |
Persistent Identifier | http://hdl.handle.net/10722/303205 |
ISSN | 2023 Impact Factor: 8.1 2023 SCImago Journal Rankings: 3.040 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Haataja, Mikko | - |
dc.contributor.author | Srolovitz, David J. | - |
dc.date.accessioned | 2021-09-15T08:24:50Z | - |
dc.date.available | 2021-09-15T08:24:50Z | - |
dc.date.issued | 2002 | - |
dc.identifier.citation | Physical Review Letters, 2002, v. 89, n. 21, article no. 215509 | - |
dc.identifier.issn | 0031-9007 | - |
dc.identifier.uri | http://hdl.handle.net/10722/303205 | - |
dc.description.abstract | Experiments show that electrodeposited (ED) films exhibit rough surfaces unless the electrochemical bath contains small quantities of molecular “additive” species. We develop a model for ED with additives which shows the suppression of the morphological instability by preferential additive accumulation near surface protrusions due to complex formation and additive codeposition, and subsequent growth site blocking. Linearly stable growth can be achieved over a wide range of deposition flux at sufficiently large additive bulk concentration. We predict the growth conditions necessary for level surfaces, in good agreement with experiments. © 2002 The American Physical Society. | - |
dc.language | eng | - |
dc.relation.ispartof | Physical Review Letters | - |
dc.title | Morphological Instability and Additive-Induced Stabilization in Electrodeposition | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1103/PhysRevLett.89.215509 | - |
dc.identifier.pmid | 12443431 | - |
dc.identifier.scopus | eid_2-s2.0-0037132290 | - |
dc.identifier.volume | 89 | - |
dc.identifier.issue | 21 | - |
dc.identifier.spage | article no. 215509 | - |
dc.identifier.epage | article no. 215509 | - |
dc.identifier.eissn | 1079-7114 | - |
dc.identifier.isi | WOS:000179068000038 | - |