File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Morphological Stability during Electrodeposition II. Additive Effects

TitleMorphological Stability during Electrodeposition II. Additive Effects
Authors
Issue Date2003
Citation
Journal of the Electrochemical Society, 2003, v. 150, n. 10, p. C708-C716 How to Cite?
AbstractCommon experience shows that electrodeposited (ED) metallic films exhibit rough surfaces unless the electrochemical bath contains small quantities of molecular additives. We develop a formalism for describing the effects of additives on surface morphology evolution, which builds on that in a companion paper for the additive-free case. We demonstrate that the additives suppress the morphological instability that leads to roughening by preferentially accumulating near surface protrusions and blocking growth sites. Our chemically based model shows that additives which readily adsorb onto the surface and have a strong tendency to complex with the metal cations reduce the driving force for the instability and thus enhance leveling. Furthermore, polar additives provide an additional stabilizing effect, in accord with experimental observations. It is also shown that linearly stable growth can be achieved over a wide range of deposition flux at sufficiently large additive bulk concentrations. We predict the ED conditions necessary for growing flat films and demonstrate that these are in good agreement with experimental observations. © 2003 The Electrochemical Society. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/303220
ISSN
2023 Impact Factor: 3.1
2023 SCImago Journal Rankings: 0.868
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorHaataja, Mikko-
dc.contributor.authorSrolovitz, David J.-
dc.contributor.authorBocarsly, Andrew B.-
dc.date.accessioned2021-09-15T08:24:52Z-
dc.date.available2021-09-15T08:24:52Z-
dc.date.issued2003-
dc.identifier.citationJournal of the Electrochemical Society, 2003, v. 150, n. 10, p. C708-C716-
dc.identifier.issn0013-4651-
dc.identifier.urihttp://hdl.handle.net/10722/303220-
dc.description.abstractCommon experience shows that electrodeposited (ED) metallic films exhibit rough surfaces unless the electrochemical bath contains small quantities of molecular additives. We develop a formalism for describing the effects of additives on surface morphology evolution, which builds on that in a companion paper for the additive-free case. We demonstrate that the additives suppress the morphological instability that leads to roughening by preferentially accumulating near surface protrusions and blocking growth sites. Our chemically based model shows that additives which readily adsorb onto the surface and have a strong tendency to complex with the metal cations reduce the driving force for the instability and thus enhance leveling. Furthermore, polar additives provide an additional stabilizing effect, in accord with experimental observations. It is also shown that linearly stable growth can be achieved over a wide range of deposition flux at sufficiently large additive bulk concentrations. We predict the ED conditions necessary for growing flat films and demonstrate that these are in good agreement with experimental observations. © 2003 The Electrochemical Society. All rights reserved.-
dc.languageeng-
dc.relation.ispartofJournal of the Electrochemical Society-
dc.titleMorphological Stability during Electrodeposition II. Additive Effects-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1149/1.1602456-
dc.identifier.scopuseid_2-s2.0-0142053138-
dc.identifier.volume150-
dc.identifier.issue10-
dc.identifier.spageC708-
dc.identifier.epageC716-
dc.identifier.isiWOS:000185639800030-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats