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Article: Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films
Title | Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films |
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Authors | |
Issue Date | 2007 |
Citation | Electrochemical and Solid-State Letters, 2007, v. 10, n. 2 How to Cite? |
Abstract | Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8 Ge0.2 (001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration. © 2006 The Electrochemical Society. |
Persistent Identifier | http://hdl.handle.net/10722/303292 |
ISSN | 2014 Impact Factor: 2.321 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Yao, H. B. | - |
dc.contributor.author | Bouville, M. | - |
dc.contributor.author | Chi, D. Z. | - |
dc.contributor.author | Sun, H. P. | - |
dc.contributor.author | Pan, X. Q. | - |
dc.contributor.author | Srolovitz, D. J. | - |
dc.contributor.author | Mangelinck, D. | - |
dc.date.accessioned | 2021-09-15T08:25:01Z | - |
dc.date.available | 2021-09-15T08:25:01Z | - |
dc.date.issued | 2007 | - |
dc.identifier.citation | Electrochemical and Solid-State Letters, 2007, v. 10, n. 2 | - |
dc.identifier.issn | 1099-0062 | - |
dc.identifier.uri | http://hdl.handle.net/10722/303292 | - |
dc.description.abstract | Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8 Ge0.2 (001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration. © 2006 The Electrochemical Society. | - |
dc.language | eng | - |
dc.relation.ispartof | Electrochemical and Solid-State Letters | - |
dc.title | Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1149/1.2400726 | - |
dc.identifier.scopus | eid_2-s2.0-33845921497 | - |
dc.identifier.volume | 10 | - |
dc.identifier.issue | 2 | - |
dc.identifier.isi | WOS:000243640400019 | - |