File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Compressive film stress in a thin, tensile heteroepitaxial film

TitleCompressive film stress in a thin, tensile heteroepitaxial film
Authors
Issue Date2008
Citation
Applied Physics Letters, 2008, v. 93, n. 1, article no. 011903 How to Cite?
AbstractWe performed atomistic scale simulations to simulate the heteroepitaxial growth of a film with a 0.62% tensile misfit strain and monitored the stress evolution. The calculated f tf is initially compressive but increases after the first monolayer is completed. We provide theoretical and simulation evidence that this effect is associated with surface stresses. These results demonstrate that wafer curvature measurements lead to unreliable predictions of film stresses when the film is very thin. © 2008 American Institute of Physics.
Persistent Identifierhttp://hdl.handle.net/10722/303332
ISSN
2023 Impact Factor: 3.5
2023 SCImago Journal Rankings: 0.976
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorPao, Chun Wei-
dc.contributor.authorSrolovitz, David J.-
dc.date.accessioned2021-09-15T08:25:05Z-
dc.date.available2021-09-15T08:25:05Z-
dc.date.issued2008-
dc.identifier.citationApplied Physics Letters, 2008, v. 93, n. 1, article no. 011903-
dc.identifier.issn0003-6951-
dc.identifier.urihttp://hdl.handle.net/10722/303332-
dc.description.abstractWe performed atomistic scale simulations to simulate the heteroepitaxial growth of a film with a 0.62% tensile misfit strain and monitored the stress evolution. The calculated f tf is initially compressive but increases after the first monolayer is completed. We provide theoretical and simulation evidence that this effect is associated with surface stresses. These results demonstrate that wafer curvature measurements lead to unreliable predictions of film stresses when the film is very thin. © 2008 American Institute of Physics.-
dc.languageeng-
dc.relation.ispartofApplied Physics Letters-
dc.titleCompressive film stress in a thin, tensile heteroepitaxial film-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1063/1.2955833-
dc.identifier.scopuseid_2-s2.0-47249112085-
dc.identifier.volume93-
dc.identifier.issue1-
dc.identifier.spagearticle no. 011903-
dc.identifier.epagearticle no. 011903-
dc.identifier.isiWOS:000258184600018-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats