File Download

There are no files associated with this item.

  Links for fulltext
     (May Require Subscription)
Supplementary

Article: Formation of nanostructured copper filaments in electrochemical deposition

TitleFormation of nanostructured copper filaments in electrochemical deposition
Authors
Issue Date2003
Citation
Physical Review E - Statistical, Nonlinear, and Soft Matter Physics, 2003, v. 67, n. 6, article no. 061601 How to Cite?
AbstractNanostructured copper filaments in an ultrathin layer of CuSO4 solution were formed. The macroscopically fingering electrodeposit differs from previous experimental observations in every microscopic detail. The most essential character of the electrodeposit is that the filaments become much smoother and more regular. The spatial period of the nanostructures on the filaments depends on the control parameters, such as the voltage or current in the electrodeposition.
Persistent Identifierhttp://hdl.handle.net/10722/310379
ISSN
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorZhong, Sheng-
dc.contributor.authorWang, Yuan-
dc.contributor.authorWang, Mu-
dc.contributor.authorZhang, Min Zhe-
dc.contributor.authorYin, Xiao Bo-
dc.contributor.authorPeng, Ru Wen-
dc.contributor.authorMing, Nai Ben-
dc.date.accessioned2022-01-31T06:04:44Z-
dc.date.available2022-01-31T06:04:44Z-
dc.date.issued2003-
dc.identifier.citationPhysical Review E - Statistical, Nonlinear, and Soft Matter Physics, 2003, v. 67, n. 6, article no. 061601-
dc.identifier.issn1063-651X-
dc.identifier.urihttp://hdl.handle.net/10722/310379-
dc.description.abstractNanostructured copper filaments in an ultrathin layer of CuSO4 solution were formed. The macroscopically fingering electrodeposit differs from previous experimental observations in every microscopic detail. The most essential character of the electrodeposit is that the filaments become much smoother and more regular. The spatial period of the nanostructures on the filaments depends on the control parameters, such as the voltage or current in the electrodeposition.-
dc.languageeng-
dc.relation.ispartofPhysical Review E - Statistical, Nonlinear, and Soft Matter Physics-
dc.titleFormation of nanostructured copper filaments in electrochemical deposition-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1103/PhysRevE.67.061601-
dc.identifier.scopuseid_2-s2.0-42749106590-
dc.identifier.volume67-
dc.identifier.issue6-
dc.identifier.spagearticle no. 061601-
dc.identifier.epagearticle no. 061601-
dc.identifier.isiWOS:000184081000049-

Export via OAI-PMH Interface in XML Formats


OR


Export to Other Non-XML Formats