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Article: Constructing an ohmic junction of copper@ cuprous oxide nanocomposite with plasmonic enhancement for photocatalysis

TitleConstructing an ohmic junction of copper@ cuprous oxide nanocomposite with plasmonic enhancement for photocatalysis
Authors
Dai, BZhao, WHuang, HLi, SYang, GWu, HSun, CLeung, YCD
Issue Date2022
PublisherElsevier Inc.. The Journal's web site is located at http://www.elsevier.com/locate/jcis
Citation
Journal of Colloid and Interface Science, 2022, v. 616, p. 163-176 How to Cite?
DOI: http://dx.doi.org/10.1016/j.jcis.2022.02.056
Persistent Identifierhttp://hdl.handle.net/10722/314703
ISI Accession Number ID
WOS:000792125800004

 

DC FieldValueLanguage
dc.contributor.authorDai, B-
dc.contributor.authorZhao, W-
dc.contributor.authorHuang, H-
dc.contributor.authorLi, S-
dc.contributor.authorYang, G-
dc.contributor.authorWu, H-
dc.contributor.authorSun, C-
dc.contributor.authorLeung, YCD-
dc.date.accessioned2022-08-05T09:33:04Z-
dc.date.available2022-08-05T09:33:04Z-
dc.date.issued2022-
dc.identifier.citationJournal of Colloid and Interface Science, 2022, v. 616, p. 163-176-
dc.identifier.urihttp://hdl.handle.net/10722/314703-
dc.languageeng-
dc.publisherElsevier Inc.. The Journal's web site is located at http://www.elsevier.com/locate/jcis-
dc.relation.ispartofJournal of Colloid and Interface Science-
dc.titleConstructing an ohmic junction of copper@ cuprous oxide nanocomposite with plasmonic enhancement for photocatalysis-
dc.typeArticle-
dc.identifier.emailLeung, YCD: ycleung@hku.hk-
dc.identifier.authorityLeung, YCD=rp00149-
dc.identifier.doi10.1016/j.jcis.2022.02.056-
dc.identifier.hkuros335254-
dc.identifier.volume616-
dc.identifier.spage163-
dc.identifier.epage176-
dc.identifier.isiWOS:000792125800004-
dc.publisher.placeNetherlands-

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