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- Publisher Website: 10.1557/proc-1156-d07-04
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Conference Paper: Direct metal nano-patterning using embossed solid electrolyte
Title | Direct metal nano-patterning using embossed solid electrolyte |
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Authors | |
Issue Date | 2009 |
Citation | Materials Research Society Symposium Proceedings, 2009, v. 1156, p. 141-146 How to Cite? |
Abstract | In this letter we introduce a new approach to fabricating nano-scale metallic features by combining best merits of micro-forming, nanoimprint lithography, and electrochemical nanoimprinting. We study the mechanical properties of Ag2S, a solid-state superionic conductor previously reported by Hsu et al. [1] for electrochemical nanoimprinting (S4 process), and explore its capability for embossing using a Si mold fabricated using electron-beam lithography. By circumventing the traditional route of stamp preparation using Focused Ion Beam (FIB), we greatly enhance the capability of electrochemical nanoimprinting. Using an embossed stamp, we demonstrate features <10 nm; and patterns on areas >30 mm2. Application of an embossed Ag2S stamp is a significant step towards extending the S4 process for direct metal patterning of features beyond the capability of current processes. © 2009 Materials Research Society. |
Persistent Identifier | http://hdl.handle.net/10722/318474 |
ISSN | 2019 SCImago Journal Rankings: 0.114 |
DC Field | Value | Language |
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dc.contributor.author | Kumar, Anil | - |
dc.contributor.author | Hsu, Keng | - |
dc.contributor.author | Jacobs, Kyle | - |
dc.contributor.author | Ferreira, Placid | - |
dc.contributor.author | Fang, Nicholas | - |
dc.date.accessioned | 2022-10-11T12:23:50Z | - |
dc.date.available | 2022-10-11T12:23:50Z | - |
dc.date.issued | 2009 | - |
dc.identifier.citation | Materials Research Society Symposium Proceedings, 2009, v. 1156, p. 141-146 | - |
dc.identifier.issn | 0272-9172 | - |
dc.identifier.uri | http://hdl.handle.net/10722/318474 | - |
dc.description.abstract | In this letter we introduce a new approach to fabricating nano-scale metallic features by combining best merits of micro-forming, nanoimprint lithography, and electrochemical nanoimprinting. We study the mechanical properties of Ag2S, a solid-state superionic conductor previously reported by Hsu et al. [1] for electrochemical nanoimprinting (S4 process), and explore its capability for embossing using a Si mold fabricated using electron-beam lithography. By circumventing the traditional route of stamp preparation using Focused Ion Beam (FIB), we greatly enhance the capability of electrochemical nanoimprinting. Using an embossed stamp, we demonstrate features <10 nm; and patterns on areas >30 mm2. Application of an embossed Ag2S stamp is a significant step towards extending the S4 process for direct metal patterning of features beyond the capability of current processes. © 2009 Materials Research Society. | - |
dc.language | eng | - |
dc.relation.ispartof | Materials Research Society Symposium Proceedings | - |
dc.title | Direct metal nano-patterning using embossed solid electrolyte | - |
dc.type | Conference_Paper | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1557/proc-1156-d07-04 | - |
dc.identifier.scopus | eid_2-s2.0-77649098188 | - |
dc.identifier.volume | 1156 | - |
dc.identifier.spage | 141 | - |
dc.identifier.epage | 146 | - |