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Article: Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature

TitleThermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature
Authors
WANG, YHuang, YTLIU, YFeng, S.P.Huang, M
Issue Date2022
Citation
Scripta Materialia, 2022, v. 220, p. 114900 How to Cite?
DOI: http://dx.doi.org/10.1016/j.scriptamat.2022.114900
Persistent Identifierhttp://hdl.handle.net/10722/319937
ISI Accession Number ID
WOS:000826907700004

 

DC FieldValueLanguage
dc.contributor.authorWANG, Y-
dc.contributor.authorHuang, YT-
dc.contributor.authorLIU, Y-
dc.contributor.authorFeng, S.P.-
dc.contributor.authorHuang, M-
dc.date.accessioned2022-10-14T05:22:29Z-
dc.date.available2022-10-14T05:22:29Z-
dc.date.issued2022-
dc.identifier.citationScripta Materialia, 2022, v. 220, p. 114900-
dc.identifier.urihttp://hdl.handle.net/10722/319937-
dc.languageeng-
dc.relation.ispartofScripta Materialia-
dc.titleThermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature-
dc.typeArticle-
dc.identifier.emailHuang, YT: ythuang@connect.hku.hk-
dc.identifier.emailHuang, M: mxhuang@hku.hk-
dc.identifier.authorityHuang, M=rp01418-
dc.identifier.doi10.1016/j.scriptamat.2022.114900-
dc.identifier.hkuros339454-
dc.identifier.volume220-
dc.identifier.spage114900-
dc.identifier.epage114900-
dc.identifier.isiWOS:000826907700004-

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