File Download
There are no files associated with this item.
Links for fulltext
(May Require Subscription)
- Publisher Website: 10.1016/j.scriptamat.2022.114900
- WOS: WOS:000826907700004
Supplementary
-
Citations:
- Web of Science: 0
- Appears in Collections:
Article: Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature
Title | Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature |
---|---|
Authors | |
Issue Date | 2022 |
Citation | Scripta Materialia, 2022, v. 220, p. 114900 How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/319937 |
ISI Accession Number ID |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | WANG, Y | - |
dc.contributor.author | Huang, YT | - |
dc.contributor.author | LIU, Y | - |
dc.contributor.author | Feng, S.P. | - |
dc.contributor.author | Huang, M | - |
dc.date.accessioned | 2022-10-14T05:22:29Z | - |
dc.date.available | 2022-10-14T05:22:29Z | - |
dc.date.issued | 2022 | - |
dc.identifier.citation | Scripta Materialia, 2022, v. 220, p. 114900 | - |
dc.identifier.uri | http://hdl.handle.net/10722/319937 | - |
dc.language | eng | - |
dc.relation.ispartof | Scripta Materialia | - |
dc.title | Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature | - |
dc.type | Article | - |
dc.identifier.email | Huang, YT: ythuang@connect.hku.hk | - |
dc.identifier.email | Huang, M: mxhuang@hku.hk | - |
dc.identifier.authority | Huang, M=rp01418 | - |
dc.identifier.doi | 10.1016/j.scriptamat.2022.114900 | - |
dc.identifier.hkuros | 339454 | - |
dc.identifier.volume | 220 | - |
dc.identifier.spage | 114900 | - |
dc.identifier.epage | 114900 | - |
dc.identifier.isi | WOS:000826907700004 | - |