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- Publisher Website: 10.1002/admi.202200865
- WOS: WOS:000849566400001
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Article: Dual‐Functional Anti‐Pathogen Coatings
| Title | Dual‐Functional Anti‐Pathogen Coatings |
|---|---|
| Authors | |
| Issue Date | 2022 |
| Publisher | Wiley. The Journal's web site is located at http://www.ami-journal.com/ |
| Citation | Advanced Materials Interfaces, 2022, v. 9 n. 28, p. 2200865 How to Cite? |
| Persistent Identifier | http://hdl.handle.net/10722/322977 |
| ISI Accession Number ID |
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chu, Y | - |
| dc.contributor.author | WANG, Y | - |
| dc.contributor.author | Liu, AM | - |
| dc.contributor.author | Chen, GY | - |
| dc.contributor.author | LI, W | - |
| dc.contributor.author | Wang, XH | - |
| dc.contributor.author | Chu, H | - |
| dc.contributor.author | Wang, L | - |
| dc.date.accessioned | 2022-11-18T11:46:08Z | - |
| dc.date.available | 2022-11-18T11:46:08Z | - |
| dc.date.issued | 2022 | - |
| dc.identifier.citation | Advanced Materials Interfaces, 2022, v. 9 n. 28, p. 2200865 | - |
| dc.identifier.uri | http://hdl.handle.net/10722/322977 | - |
| dc.language | eng | - |
| dc.publisher | Wiley. The Journal's web site is located at http://www.ami-journal.com/ | - |
| dc.relation.ispartof | Advanced Materials Interfaces | - |
| dc.rights | Submitted (preprint) Version This is the pre-peer reviewed version of the following article: [FULL CITE], which has been published in final form at [Link to final article using the DOI]. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions. Accepted (peer-reviewed) Version This is the peer reviewed version of the following article: [FULL CITE], which has been published in final form at [Link to final article using the DOI]. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions. | - |
| dc.title | Dual‐Functional Anti‐Pathogen Coatings | - |
| dc.type | Article | - |
| dc.identifier.email | Chu, H: hinchu@hku.hk | - |
| dc.identifier.email | Wang, L: lqwang@hku.hk | - |
| dc.identifier.authority | Chu, H=rp02125 | - |
| dc.identifier.authority | Wang, L=rp00184 | - |
| dc.identifier.doi | 10.1002/admi.202200865 | - |
| dc.identifier.hkuros | 342450 | - |
| dc.identifier.volume | 9 | - |
| dc.identifier.issue | 28 | - |
| dc.identifier.spage | 2200865 | - |
| dc.identifier.epage | 2200865 | - |
| dc.identifier.isi | WOS:000849566400001 | - |
| dc.publisher.place | USA | - |