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- Publisher Website: 10.3390/e21020146
- Scopus: eid_2-s2.0-85061968948
- WOS: WOS:000460742200047
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Article: High strength and deformation mechanisms of Al0.3 CoCrFeNi high-entropy alloy thin films fabricated by magnetron sputtering
Title | High strength and deformation mechanisms of Al<inf>0.3</inf>CoCrFeNi high-entropy alloy thin films fabricated by magnetron sputtering |
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Authors | |
Keywords | Deformation behaviors Hardness High-entropy alloys Nanocrystalline Thin films |
Issue Date | 2019 |
Citation | Entropy, 2019, v. 21, n. 2, article no. 146 How to Cite? |
Abstract | Recently, high-entropy alloy thin films (HEATFs) with nanocrystalline structures and high hardness were developed by magnetron sputtering technique and have exciting potential to make small structure devices and precision instruments with sizes ranging from nanometers to micrometers. However, the strength and deformation mechanisms are still unclear. In this work, nanocrystalline Al0.3CoCrFeNi HEATFs with a thickness of ~4 μm were prepared. The microstructures of the thin films were comprehensively characterized, and the mechanical properties were systematically studied. It was found that the thin film was smooth, with a roughness of less than 5 nm. The chemical composition of the high entropy alloy thin film was homogeneous with a main single face-centered cubic (FCC) structure. Furthermore, it was observed that the hardness and the yield strength of the high-entropy alloy thin film was about three times that of the bulk samples, and the plastic deformation was inhomogeneous. Our results could provide an in-depth understanding of the mechanics and deformation mechanism for future design of nanocrystalline HEATFs with desired properties. |
Persistent Identifier | http://hdl.handle.net/10722/326179 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Liao, Wei Bing | - |
dc.contributor.author | Zhang, Hongti | - |
dc.contributor.author | Liu, Zhi Yuan | - |
dc.contributor.author | Li, Pei Feng | - |
dc.contributor.author | Huang, Jian Jun | - |
dc.contributor.author | Yu, Chun Yan | - |
dc.contributor.author | Lu, Yang | - |
dc.date.accessioned | 2023-03-09T09:58:37Z | - |
dc.date.available | 2023-03-09T09:58:37Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | Entropy, 2019, v. 21, n. 2, article no. 146 | - |
dc.identifier.uri | http://hdl.handle.net/10722/326179 | - |
dc.description.abstract | Recently, high-entropy alloy thin films (HEATFs) with nanocrystalline structures and high hardness were developed by magnetron sputtering technique and have exciting potential to make small structure devices and precision instruments with sizes ranging from nanometers to micrometers. However, the strength and deformation mechanisms are still unclear. In this work, nanocrystalline Al0.3CoCrFeNi HEATFs with a thickness of ~4 μm were prepared. The microstructures of the thin films were comprehensively characterized, and the mechanical properties were systematically studied. It was found that the thin film was smooth, with a roughness of less than 5 nm. The chemical composition of the high entropy alloy thin film was homogeneous with a main single face-centered cubic (FCC) structure. Furthermore, it was observed that the hardness and the yield strength of the high-entropy alloy thin film was about three times that of the bulk samples, and the plastic deformation was inhomogeneous. Our results could provide an in-depth understanding of the mechanics and deformation mechanism for future design of nanocrystalline HEATFs with desired properties. | - |
dc.language | eng | - |
dc.relation.ispartof | Entropy | - |
dc.subject | Deformation behaviors | - |
dc.subject | Hardness | - |
dc.subject | High-entropy alloys | - |
dc.subject | Nanocrystalline | - |
dc.subject | Thin films | - |
dc.title | High strength and deformation mechanisms of Al<inf>0.3</inf>CoCrFeNi high-entropy alloy thin films fabricated by magnetron sputtering | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.3390/e21020146 | - |
dc.identifier.scopus | eid_2-s2.0-85061968948 | - |
dc.identifier.volume | 21 | - |
dc.identifier.issue | 2 | - |
dc.identifier.spage | article no. 146 | - |
dc.identifier.epage | article no. 146 | - |
dc.identifier.eissn | 1099-4300 | - |
dc.identifier.isi | WOS:000460742200047 | - |