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- Publisher Website: 10.1007/s11661-019-05209-w
- Scopus: eid_2-s2.0-85065519488
- WOS: WOS:000469795200001
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Article: Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires
| Title | Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires |
|---|---|
| Authors | |
| Issue Date | 2019 |
| Citation | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 2019, v. 50, n. 7, p. 3013-3018 How to Cite? |
| Abstract | Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications. |
| Persistent Identifier | http://hdl.handle.net/10722/326185 |
| ISSN | 2023 Impact Factor: 2.2 2023 SCImago Journal Rankings: 0.761 |
| ISI Accession Number ID |
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yang, Hao Kun | - |
| dc.contributor.author | Cao, Ke | - |
| dc.contributor.author | Lu, Jian | - |
| dc.contributor.author | Lu, Yang | - |
| dc.date.accessioned | 2023-03-09T09:58:44Z | - |
| dc.date.available | 2023-03-09T09:58:44Z | - |
| dc.date.issued | 2019 | - |
| dc.identifier.citation | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 2019, v. 50, n. 7, p. 3013-3018 | - |
| dc.identifier.issn | 1073-5623 | - |
| dc.identifier.uri | http://hdl.handle.net/10722/326185 | - |
| dc.description.abstract | Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications. | - |
| dc.language | eng | - |
| dc.relation.ispartof | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | - |
| dc.title | Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires | - |
| dc.type | Article | - |
| dc.description.nature | link_to_subscribed_fulltext | - |
| dc.identifier.doi | 10.1007/s11661-019-05209-w | - |
| dc.identifier.scopus | eid_2-s2.0-85065519488 | - |
| dc.identifier.volume | 50 | - |
| dc.identifier.issue | 7 | - |
| dc.identifier.spage | 3013 | - |
| dc.identifier.epage | 3018 | - |
| dc.identifier.isi | WOS:000469795200001 | - |