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Article: Lunar Dust-Mitigation Behavior of Aluminum Surfaces with Multiscale Roughness Prepared by a Composite Etching Method

TitleLunar Dust-Mitigation Behavior of Aluminum Surfaces with Multiscale Roughness Prepared by a Composite Etching Method
Authors
Keywordsadhesion
aluminum
dust-mitigation
lunar dust
multiscale structure
Issue Date2022
Citation
ACS Applied Materials and Interfaces, 2022 How to Cite?
AbstractReducing lunar dust adhesion to various material surfaces is important for protecting equipment from damage during lunar exploration missions. In this study, we investigate the lunar dust-mitigation ability and dust adhesion force of aluminum (Al) substrates prepared using different etching methods. Among them, composite etching methods (combining chemical and electrochemical steps) can result in multiscale structures with micro- and nanoroughness, reducing the contact area between the substrate and thus decreasing lunar dust adhesion. After composite etching, the dust adhesion force of the Al substrate was significantly reduced by 80% from 45.53 to 8.89 nN. The dust adhesion force of Al substrates dominates their dust-mitigation performance in floating dust environments. The lunar dust coverage (2.19%) of the Al substrate modified by composite etching (placed with a tilt angle of 90°) was 4-fold lower than that of the pristine Al substrate (9.11%), indicating excellent lunar-dust repellence. In addition, other factors such as tilt angle of the substrate and dust loading significantly affect dust-mitigation performance of the modified Al substrates. The Al substrate with an excellent dust-mitigation ability highlights good potential for lunar exploration missions.
Persistent Identifierhttp://hdl.handle.net/10722/326355
ISSN
2023 Impact Factor: 8.3
2023 SCImago Journal Rankings: 2.058
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorWang, Xiao-
dc.contributor.authorWang, Weidong-
dc.contributor.authorShao, Hong-
dc.contributor.authorChao, Shengmao-
dc.contributor.authorZhang, Haiyan-
dc.contributor.authorTang, Changyu-
dc.contributor.authorLi, Xiongyao-
dc.contributor.authorZhu, Yingmin-
dc.contributor.authorZhang, Ji-
dc.contributor.authorZhang, Xiaoping-
dc.contributor.authorLu, Yang-
dc.date.accessioned2023-03-09T10:00:01Z-
dc.date.available2023-03-09T10:00:01Z-
dc.date.issued2022-
dc.identifier.citationACS Applied Materials and Interfaces, 2022-
dc.identifier.issn1944-8244-
dc.identifier.urihttp://hdl.handle.net/10722/326355-
dc.description.abstractReducing lunar dust adhesion to various material surfaces is important for protecting equipment from damage during lunar exploration missions. In this study, we investigate the lunar dust-mitigation ability and dust adhesion force of aluminum (Al) substrates prepared using different etching methods. Among them, composite etching methods (combining chemical and electrochemical steps) can result in multiscale structures with micro- and nanoroughness, reducing the contact area between the substrate and thus decreasing lunar dust adhesion. After composite etching, the dust adhesion force of the Al substrate was significantly reduced by 80% from 45.53 to 8.89 nN. The dust adhesion force of Al substrates dominates their dust-mitigation performance in floating dust environments. The lunar dust coverage (2.19%) of the Al substrate modified by composite etching (placed with a tilt angle of 90°) was 4-fold lower than that of the pristine Al substrate (9.11%), indicating excellent lunar-dust repellence. In addition, other factors such as tilt angle of the substrate and dust loading significantly affect dust-mitigation performance of the modified Al substrates. The Al substrate with an excellent dust-mitigation ability highlights good potential for lunar exploration missions.-
dc.languageeng-
dc.relation.ispartofACS Applied Materials and Interfaces-
dc.subjectadhesion-
dc.subjectaluminum-
dc.subjectdust-mitigation-
dc.subjectlunar dust-
dc.subjectmultiscale structure-
dc.titleLunar Dust-Mitigation Behavior of Aluminum Surfaces with Multiscale Roughness Prepared by a Composite Etching Method-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1021/acsami.2c07237-
dc.identifier.scopuseid_2-s2.0-85135228950-
dc.identifier.eissn1944-8252-
dc.identifier.isiWOS:000828727500001-

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