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- Publisher Website: 10.1016/j.mser.2022.100701
- Scopus: eid_2-s2.0-85139023141
- WOS: WOS:000869547000001
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Article: Low temperature interfacial reaction in 3D IC nanoscale materials
Title | Low temperature interfacial reaction in 3D IC nanoscale materials |
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Authors | |
Keywords | Cold welding Cu-to-Cu direct bonding Nano welding Nanowires Point contact reaction Pulley-type contacts Surface creep |
Issue Date | 2022 |
Citation | Materials Science and Engineering R: Reports, 2022, v. 151, article no. 100701 How to Cite? |
Abstract | In this review, we cover copper-to-copper (Cu-to-Cu) direct bonding, point contact reaction between silicon (Si) nanowire and metal nanowire, and cold welding of gold (Au) and silver (Ag) nanowires. All of them occur under nanoscale interfaces at low temperatures. For a broader consideration, because Cu is known to exhibit significant anti-pathogen and anti-viral properties, the interfacial reaction in Cu nano-grain metallurgy may be used to manufacture Cu and Cu alloy products to reduce virus transmission, which can have a very large impact to our society. Furthermore, in the future semiconductor technology, because of dense packaging, Joule heating will be serious. Thus, low entropy production process will receive attention, which means low temperature joining technology such as cold welding and nano-welding will be important. |
Persistent Identifier | http://hdl.handle.net/10722/326363 |
ISSN | 2023 Impact Factor: 31.6 2023 SCImago Journal Rankings: 6.822 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Liu, Yingxia | - |
dc.contributor.author | Lu, Yang | - |
dc.contributor.author | Tu, K. N. | - |
dc.date.accessioned | 2023-03-09T10:00:05Z | - |
dc.date.available | 2023-03-09T10:00:05Z | - |
dc.date.issued | 2022 | - |
dc.identifier.citation | Materials Science and Engineering R: Reports, 2022, v. 151, article no. 100701 | - |
dc.identifier.issn | 0927-796X | - |
dc.identifier.uri | http://hdl.handle.net/10722/326363 | - |
dc.description.abstract | In this review, we cover copper-to-copper (Cu-to-Cu) direct bonding, point contact reaction between silicon (Si) nanowire and metal nanowire, and cold welding of gold (Au) and silver (Ag) nanowires. All of them occur under nanoscale interfaces at low temperatures. For a broader consideration, because Cu is known to exhibit significant anti-pathogen and anti-viral properties, the interfacial reaction in Cu nano-grain metallurgy may be used to manufacture Cu and Cu alloy products to reduce virus transmission, which can have a very large impact to our society. Furthermore, in the future semiconductor technology, because of dense packaging, Joule heating will be serious. Thus, low entropy production process will receive attention, which means low temperature joining technology such as cold welding and nano-welding will be important. | - |
dc.language | eng | - |
dc.relation.ispartof | Materials Science and Engineering R: Reports | - |
dc.subject | Cold welding | - |
dc.subject | Cu-to-Cu direct bonding | - |
dc.subject | Nano welding | - |
dc.subject | Nanowires | - |
dc.subject | Point contact reaction | - |
dc.subject | Pulley-type contacts | - |
dc.subject | Surface creep | - |
dc.title | Low temperature interfacial reaction in 3D IC nanoscale materials | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/j.mser.2022.100701 | - |
dc.identifier.scopus | eid_2-s2.0-85139023141 | - |
dc.identifier.volume | 151 | - |
dc.identifier.spage | article no. 100701 | - |
dc.identifier.epage | article no. 100701 | - |
dc.identifier.isi | WOS:000869547000001 | - |