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Article: Temperature-Triggered Supramolecular Assembly of Organic Semiconductors

TitleTemperature-Triggered Supramolecular Assembly of Organic Semiconductors
Authors
Keywordscold crystallization
noncovalent bonding interactions
organic field-effect transistors
semiconductors
solution processability
[π···π] interactions
Issue Date2022
Citation
Advanced Materials, 2022, v. 34, n. 22, article no. 2101487 How to Cite?
AbstractSupramolecular assembly is a promising bottom-up approach for producing materials that behave as charge transporting components in electronic devices. Although extensive advances have been made during the past two decades, formidable challenges exist in controlling the local randomness present in supramolecular assemblies. Here, a temperature-triggered supramolecular assembly strategy using heat to heal defects and disorders is reported. The central concept of the molecular design—named the "Tetris strategy" in this research—is to: i) increase the rotational freedom of the molecules through thermal perturbation, ii) induce conformation-fitting of adjacent molecules through two different kinds of intermolecular [π···π] interactions, and finally iii) lock the nearby molecules in inactive co-conformations. Experimentally, upon heating to 57 °C, amorphous solid-state films undergo spontaneous assembly, leading to the growth of uniform and highly ordered microwire arrays. Temperature-triggered supramolecular assembly provides an approach closer to the precision control of assembled structures and presents with a broad canvas to work on in approaching a new generation of supramolecular electronics. Tetris is a registered trademark of Tetris Holding, LLC, used with permission.
Persistent Identifierhttp://hdl.handle.net/10722/333509
ISSN
2021 Impact Factor: 32.086
2020 SCImago Journal Rankings: 10.707

 

DC FieldValueLanguage
dc.contributor.authorChen, Hongliang-
dc.contributor.authorZhang, Weining-
dc.contributor.authorRen, Shizhao-
dc.contributor.authorZhao, Xingang-
dc.contributor.authorJiao, Yang-
dc.contributor.authorWang, Yu-
dc.contributor.authorStoddart, J. Fraser-
dc.contributor.authorGuo, Xuefeng-
dc.date.accessioned2023-10-06T05:20:03Z-
dc.date.available2023-10-06T05:20:03Z-
dc.date.issued2022-
dc.identifier.citationAdvanced Materials, 2022, v. 34, n. 22, article no. 2101487-
dc.identifier.issn0935-9648-
dc.identifier.urihttp://hdl.handle.net/10722/333509-
dc.description.abstractSupramolecular assembly is a promising bottom-up approach for producing materials that behave as charge transporting components in electronic devices. Although extensive advances have been made during the past two decades, formidable challenges exist in controlling the local randomness present in supramolecular assemblies. Here, a temperature-triggered supramolecular assembly strategy using heat to heal defects and disorders is reported. The central concept of the molecular design—named the "Tetris strategy" in this research—is to: i) increase the rotational freedom of the molecules through thermal perturbation, ii) induce conformation-fitting of adjacent molecules through two different kinds of intermolecular [π···π] interactions, and finally iii) lock the nearby molecules in inactive co-conformations. Experimentally, upon heating to 57 °C, amorphous solid-state films undergo spontaneous assembly, leading to the growth of uniform and highly ordered microwire arrays. Temperature-triggered supramolecular assembly provides an approach closer to the precision control of assembled structures and presents with a broad canvas to work on in approaching a new generation of supramolecular electronics. Tetris is a registered trademark of Tetris Holding, LLC, used with permission.-
dc.languageeng-
dc.relation.ispartofAdvanced Materials-
dc.subjectcold crystallization-
dc.subjectnoncovalent bonding interactions-
dc.subjectorganic field-effect transistors-
dc.subjectsemiconductors-
dc.subjectsolution processability-
dc.subject[π···π] interactions-
dc.titleTemperature-Triggered Supramolecular Assembly of Organic Semiconductors-
dc.typeArticle-
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1002/adma.202101487-
dc.identifier.pmid34247415-
dc.identifier.scopuseid_2-s2.0-85109367499-
dc.identifier.volume34-
dc.identifier.issue22-
dc.identifier.spagearticle no. 2101487-
dc.identifier.epagearticle no. 2101487-
dc.identifier.eissn1521-4095-

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