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- Publisher Website: 10.1177/096369351602500605
- Scopus: eid_2-s2.0-85016112565
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Article: Graphene encapsulating boron nitride electrostatic assemblies for fabrication of polymer composites with high thermal conductivity
Title | Graphene encapsulating boron nitride electrostatic assemblies for fabrication of polymer composites with high thermal conductivity |
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Authors | |
Keywords | Composite materials Epoxy resin Hexagonal boron nitride Reduced graphene oxide Thermal properties |
Issue Date | 2016 |
Citation | Advanced Composites Letters, 2016, v. 25, n. 6, p. 147-150 How to Cite? |
Abstract | In the recent years, significant attention has been focused in insulating electronic encapsulation materials with high thermal conductivity. We fabricated reduced graphene oxide (RGO) encapsulated h-BN hybrids (h-BN@RGO) from the thermal reduction of electrostatically assembled h-BN@GO hybrids. It is found that the addition of h-BN@RGO fillers enhances the thermal conductivity of epoxy resins while preserving the electrical insulation. The thermal conductivity achieve 3.45 W.m-1.K-1, by adding 40 wt% h-BN@RGO, which is enhanced by 1643% compared with that of neat epoxy. |
Persistent Identifier | http://hdl.handle.net/10722/335804 |
DC Field | Value | Language |
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dc.contributor.author | Huang, Tao | - |
dc.contributor.author | Yao, Yimin | - |
dc.contributor.author | Meng, Fanling | - |
dc.date.accessioned | 2023-12-28T08:48:52Z | - |
dc.date.available | 2023-12-28T08:48:52Z | - |
dc.date.issued | 2016 | - |
dc.identifier.citation | Advanced Composites Letters, 2016, v. 25, n. 6, p. 147-150 | - |
dc.identifier.uri | http://hdl.handle.net/10722/335804 | - |
dc.description.abstract | In the recent years, significant attention has been focused in insulating electronic encapsulation materials with high thermal conductivity. We fabricated reduced graphene oxide (RGO) encapsulated h-BN hybrids (h-BN@RGO) from the thermal reduction of electrostatically assembled h-BN@GO hybrids. It is found that the addition of h-BN@RGO fillers enhances the thermal conductivity of epoxy resins while preserving the electrical insulation. The thermal conductivity achieve 3.45 W.m-1.K-1, by adding 40 wt% h-BN@RGO, which is enhanced by 1643% compared with that of neat epoxy. | - |
dc.language | eng | - |
dc.relation.ispartof | Advanced Composites Letters | - |
dc.subject | Composite materials | - |
dc.subject | Epoxy resin | - |
dc.subject | Hexagonal boron nitride | - |
dc.subject | Reduced graphene oxide | - |
dc.subject | Thermal properties | - |
dc.title | Graphene encapsulating boron nitride electrostatic assemblies for fabrication of polymer composites with high thermal conductivity | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1177/096369351602500605 | - |
dc.identifier.scopus | eid_2-s2.0-85016112565 | - |
dc.identifier.volume | 25 | - |
dc.identifier.issue | 6 | - |
dc.identifier.spage | 147 | - |
dc.identifier.epage | 150 | - |
dc.identifier.eissn | 2633-366X | - |